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Patent applications and USPTO patent grants for Lee; Hyouk.The latest application filed is for "package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same".
Patent | Date |
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Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same Grant 10,522,522 - Song , et al. Dec | 2019-12-31 |
Wearable smart device having flexible semiconductor package mounted on a band Grant 10,474,192 - Song , et al. Nov | 2019-11-12 |
Package Substrate Comprising Side Pads On Edge, Chip Stack, Semiconductor Package, And Memory Module Comprising Same App 20180211943 - SONG; Young Hee ;   et al. | 2018-07-26 |
Wearable Smart Device Having Flexible Semiconductor Package Mounted On A Band App 20180210491 - SONG; Young Hee ;   et al. | 2018-07-26 |
Integrated circuit device packages and methods for manufacturing integrated circuit device packages Grant 9,559,080 - Lim , et al. January 31, 2 | 2017-01-31 |
Integrated Circuit Device Packages And Methods for Manufacturing Integrated Circuit Device Packages App 20150076683 - Lim; Jae-Sung ;   et al. | 2015-03-19 |
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