| Patent | Date |
|---|
Cooling device and process for cooling double-sided SiP devices during sputtering
Grant 11,434,561 - Kim , et al. September 6, 2 | 2022-09-06 |
Semiconductor Manufacturing Device and Method of Enhancing Mold Gate Injector and Air Vent to Reduce Voids in Encapsulant
App 20220250296 - Lee; HunTeak ; et al. | 2022-08-11 |
Semiconductor device and method of forming an integrated SiP module with embedded inductor or package
Grant 11,367,690 - Yang , et al. June 21, 2 | 2022-06-21 |
Semiconductor device and method of forming protrusion e-bar for 3D SiP
Grant 11,342,294 - Yang , et al. May 24, 2 | 2022-05-24 |
Selective EMI Shielding Using Preformed Mask
App 20220157739 - Lee; HunTeak ; et al. | 2022-05-19 |
Semiconductor Device and Method of Forming Discrete Antenna Modules
App 20220148983 - Lee; HunTeak ; et al. | 2022-05-12 |
Semiconductor device and method of forming SIP module over film layer
Grant 11,309,193 - Kim , et al. April 19, 2 | 2022-04-19 |
Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
App 20220115332 - Lee; HunTeak ; et al. | 2022-04-14 |
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
App 20220052025 - Yang; DeokKyung ; et al. | 2022-02-17 |
Method and device for reducing metal burrs when sawing semiconductor packages
Grant 11,244,908 - Lee , et al. February 8, 2 | 2022-02-08 |
Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same
Grant 11,189,598 - Yang , et al. November 30, 2 | 2021-11-30 |
Cooling Device and Process for Cooling Double-Sided SiP Devices During Sputtering
App 20210301390 - Kim; OhHan ; et al. | 2021-09-30 |
Molded Laser Package with Electromagnetic Interference Shield and Method of Making
App 20210151386 - Yang; DeokKyung ; et al. | 2021-05-20 |
Molded laser package with electromagnetic interference shield and method of making
Grant 10,937,741 - Yang , et al. March 2, 2 | 2021-03-02 |
Semiconductor Device and Method of Forming SIP Module Over Film Layer
App 20200402817 - Kim; OhHan ; et al. | 2020-12-24 |
Semiconductor Device and Method of Forming a 3D Interposer System-in-Package Module
App 20200373289 - Yang; DeokKyung ; et al. | 2020-11-26 |
Method of forming SIP module over film layer
Grant 10,804,119 - Kim , et al. October 13, 2 | 2020-10-13 |
Semiconductor device and method of forming a 3D interposer system-in-package module
Grant 10,797,039 - Yang , et al. October 6, 2 | 2020-10-06 |
Semiconductor device and method of forming a 3D integrated system-in-package module
Grant 10,790,268 - Yang , et al. September 29, 2 | 2020-09-29 |
Semiconductor Device and Method of Forming an Integrated SIP Module with Embedded Inductor or Package
App 20200286835 - Yang; DeokKyung ; et al. | 2020-09-10 |
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
App 20200219835 - Yang; DeokKyung ; et al. | 2020-07-09 |
Semiconductor Device and Method of Forming a 3D Integrated System-in-Package Module
App 20200219859 - Yang; DeokKyung ; et al. | 2020-07-09 |
Semiconductor device and method of forming an integrated SIP module with embedded inductor or package
Grant 10,700,011 - Yang , et al. | 2020-06-30 |
Molded Laser Package with Electromagnetic Interference Shield and Method of Making
App 20200161252 - Yang; DeokKyung ; et al. | 2020-05-21 |
Method and Device for Reducing Metal Burrs When Sawing Semiconductor Packages
App 20200144198 - Lee; HunTeak ; et al. | 2020-05-07 |
Semiconductor device and method of forming a 3D integrated system-in-package module
Grant 10,636,774 - Yang , et al. | 2020-04-28 |
Semiconductor device and method of forming protrusion E-bar for 3D SIP
Grant 10,636,756 - Yang , et al. | 2020-04-28 |
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
App 20200013738 - Yang; DeokKyung ; et al. | 2020-01-09 |
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
App 20200006295 - Yang; DeokKyung ; et al. | 2020-01-02 |
Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same
Grant 10,468,384 - Yang , et al. No | 2019-11-05 |
Semiconductor device and method of forming a 3D interposer system-in-package module
Grant 10,388,637 - Kim , et al. A | 2019-08-20 |
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
App 20190088621 - Yang; DeokKyung ; et al. | 2019-03-21 |
Semiconductor Device and Method of Forming a 3D Integrated System-in-Package Module
App 20190074267 - Yang; DeokKyung ; et al. | 2019-03-07 |
Semiconductor Device and Method of Forming SIP Module Over Film Layer
App 20180269195 - Kim; OhHan ; et al. | 2018-09-20 |
Semiconductor Device and Method of Forming a 3D Interposer System-in-Package Module
App 20180261569 - Yang; DeokKyung ; et al. | 2018-09-13 |
Semiconductor Device and Method of Forming a 3D Interposer System-In-Package Module
App 20180158768 - Kim; OhHan ; et al. | 2018-06-07 |
Semiconductor Device and Method of Forming an Integrated SIP Module with Embedded Inductor or Package
App 20180158779 - Yang; DeokKyung ; et al. | 2018-06-07 |
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
Grant 9,721,921 - Kim , et al. August 1, 2 | 2017-08-01 |
Semiconductor device and method of individual die bonding followed by simultaneous multiple die thermal compression bonding
Grant 9,524,958 - Choi , et al. December 20, 2 | 2016-12-20 |
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form
App 20160163675 - Kim; KyungMoon ; et al. | 2016-06-09 |
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
Grant 9,287,204 - Kim , et al. March 15, 2 | 2016-03-15 |
Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding
Grant 9,252,130 - Kim , et al. February 2, 2 | 2016-02-02 |
Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
Grant 9,236,332 - Pagaila , et al. January 12, 2 | 2016-01-12 |
Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape
Grant 8,936,969 - Lee , et al. January 20, 2 | 2015-01-20 |
Semiconductor Device and Method of Individual Die Bonding Followed by Simultaneous Multiple Die Thermal Compression Bonding
App 20150001703 - Choi; JoonYoung ; et al. | 2015-01-01 |
Methods of Manufacturing Flip Chip Semiconductor Packages Using Double-Sided Thermal Compression Bonding
App 20140295618 - Kim; KyungMoon ; et al. | 2014-10-02 |
Semiconductor Device and Method of Bonding Semiconductor Die to Substrate in Reconstituted Wafer Form
App 20140175640 - Kim; KyungMoon ; et al. | 2014-06-26 |
Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
Grant 8,563,418 - Pagaila , et al. October 22, 2 | 2013-10-22 |
Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape Residue
App 20130256840 - Yun; JaEun ; et al. | 2013-10-03 |
Semiconductor Device and Method of Singulating Semiconductor Wafer along Modified Region within Non-Active Region Formed by Irradiating Energy through Mounting Tape
App 20130249079 - Lee; Hunteak ; et al. | 2013-09-26 |
Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue
Grant 8,524,537 - Yun , et al. September 3, 2 | 2013-09-03 |
Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnect Structure on Leadframe
App 20130154067 - Pagaila; Reza A. ; et al. | 2013-06-20 |
Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
Grant 8,409,978 - Pagaila , et al. April 2, 2 | 2013-04-02 |
Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnects on Different Height Traces
App 20120025373 - Pagaila; Reza A. ; et al. | 2012-02-02 |
Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnect Structure on Leadframe
App 20110316132 - Pagaila; Reza A. ; et al. | 2011-12-29 |
Semiconductor Device and Method of Forming Protective Coating Material Over Semiconductor Wafer to Reduce Lamination Tape Residue
App 20110266656 - Yun; JaEun ; et al. | 2011-11-03 |
Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
Grant 8,039,384 - Pagaila , et al. October 18, 2 | 2011-10-18 |
Semiconductor Device And Method Of Forming Vertically Offset Bond On Trace Interconnects On Different Height Traces
App 20110221058 - Pagaila; Reza A. ; et al. | 2011-09-15 |
Wire Bonding Structure And Method That Eliminates Special Wire Bondable Finish And Reduces Bonding Pitch On Substrates
App 20110089566 - Pendse; Rajendra D. ; et al. | 2011-04-21 |
Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
Grant 7,868,468 - Pendse , et al. January 11, 2 | 2011-01-11 |
Wire Bonding Structure and Method that Eliminates Special Wire Bondable Finish and Reduces Bonding Pitch on Substrates
App 20070273043 - Pendse; Rajendra D. ; et al. | 2007-11-29 |
| 