Lee; Hsiang-Fan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Hsiang-Fan.The latest application filed is for "3dic packaging with hot spot thermal management features".

Company Profile

12.31.34

Lee; Hsiang-Fan - Hsinchu TW
Lee; Hsiang-Fan - Hsin-Chu TW
Lee; Hsiang-Fan - Hsin-Chu City TW
Lee; Hsiang-Fan - Da-Li TW
Lee, Hsiang-Fan - Da-Li city TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package with embedded heat dissipation features Grant 11,133,237 - Hung , et al. September 28, 2	2021-09-28
3DIC Packaging with Hot Spot Thermal Management Features App 20210287956 - Hung; Wensen ; et al.	2021-09-16
3DIC packaging with hot spot thermal management features Grant 11,037,852 - Hung , et al. June 15, 2	2021-06-15
Thermal Interface Material Having Different Thicknesses in Packages App 20200402926 - Huang; Sung-Hui ; et al.	2020-12-24
Semiconductor device Grant 10,867,951 - Huang , et al. December 15, 2	2020-12-15
Thermal interface material having different thicknesses in packages Grant 10,770,405 - Huang , et al. Sep	2020-09-08
Package With Embedded Heat Dissipation Features App 20200251398 - Kind Code	2020-08-06
Semiconductor Device App 20200251427 - Kind Code	2020-08-06
Thermal interface material having different thicknesses in packages Grant 10,707,177 - Huang , et al.	2020-07-07
Semiconductor device Grant 10,629,545 - Huang , et al.	2020-04-21
Package with embedded heat dissipation features Grant 10,629,510 - Hung , et al.	2020-04-21
3DIC Packaging with Hot Spot Thermal Management Features App 20200027809 - Hung; Wensen ; et al.	2020-01-23
3DIC packaging with hot spot thermal management features Grant 10,461,009 - Hung , et al. Oc	2019-10-29
Semiconductor Device App 20190244925 - HUANG; KUAN-YU ; et al.	2019-08-08
Semiconductor device and method of manufacturing the same Grant 10,340,242 - Huang , et al.	2019-07-02
3DIC Packaging with Hot Spot Thermal Management Features App 20190096781 - Hung; Wensen ; et al.	2019-03-28
Semiconductor Device And Method Of Manufacturing The Same App 20190067231 - HUANG; KUAN-YU ; et al.	2019-02-28
3DIC packaging with hot spot thermal management features Grant 10,157,813 - Hung , et al. Dec	2018-12-18
Thermal Interface Material Having Different Thicknesses In Packages App 20180350754 - Huang; Sung-Hui ; et al.	2018-12-06
Thermal Interface Material Having Different Thicknesses in Packages App 20180350755 - Huang; Sung-Hui ; et al.	2018-12-06
Package with Embedded Heat Dissipation Features App 20180269127 - Hung; Wensen ; et al.	2018-09-20
Semiconductor Device App 20180261554 - HUANG; KUAN-YU ; et al.	2018-09-13
Package with embedded heat dissipation features Grant 9,978,660 - Hung , et al. May 22, 2	2018-05-22
3DIC Packaging with Hot Spot Thermal Management Features App 20170345732 - Hung; Wensen ; et al.	2017-11-30
3DIC packaging with hot spot thermal management features Grant 9,735,082 - Hung , et al. August 15, 2	2017-08-15
Integrated circuit package with probe pad structure Grant 9,653,427 - Wu , et al. May 16, 2	2017-05-16
Packages with thermal interface material on the sidewalls of stacked dies Grant 9,583,415 - Yu , et al. February 28, 2	2017-02-28
Decoupling MIM capacitor designs for interposers and methods of manufacture thereof Grant 9,401,395 - Tzeng , et al. July 26, 2	2016-07-26
Integrated Circuit Package and Methods of Forming Same App 20160172333 - Wu; Chi-Hsi ; et al.	2016-06-16
Decoupling MIM Capacitor Designs for Interposers and Methods of Manufacture Thereof App 20160155700 - Tzeng; Kuo-Chyuan ; et al.	2016-06-02
Methods of forming integrated circuit package Grant 9,281,254 - Yu , et al. March 8, 2	2016-03-08
Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers Grant 9,269,762 - Tzeng , et al. February 23, 2	2016-02-23
Decoupling MIM capacitor designs for interposers and methods of manufacture thereof Grant 9,263,415 - Tzeng , et al. February 16, 2	2016-02-16
Decoupling MIM capacitor designs for interposers and methods of manufacture thereof Grant 9,257,409 - Tzeng , et al. February 9, 2	2016-02-09
Package with Embedded Heat Dissipation Features App 20150262904 - Hung; Wensen ; et al.	2015-09-17
Integrated Circuit Package and Methods of Forming Same App 20150228550 - Yu; Chen-Hua ; et al.	2015-08-13
Metal-Insulator-Metal (MIM) Capacitor Within Topmost Thick Inter-Metal Dielectric Layers App 20150187866 - Tzeng; Kuo-Chyuan ; et al.	2015-07-02
3DIC Packaging with Hot Spot Thermal Management Features App 20150155218 - Hung; Wensen ; et al.	2015-06-04
Packages with Thermal Interface Material on the Sidewalls of Stacked Dies App 20150108628 - Yu; Chen-Hua ; et al.	2015-04-23
Metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers Grant 8,994,146 - Tzeng , et al. March 31, 2	2015-03-31
Method of fabricating metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers Grant 8,993,405 - Tzeng , et al. March 31, 2	2015-03-31
Decoupling MIM Capacitor Designs for Interposers and Methods of Manufacture Thereof App 20140235019 - Tzeng; Kuo-Chyuan ; et al.	2014-08-21
Decoupling MIM Capacitor Designs for Interposers and Methods of Manufacture Thereof App 20140217549 - Tzeng; Kuo-Chyuan ; et al.	2014-08-07
Method Of Fabricating Metal-insulator-metal (mim) Capacitor Within Topmost Thick Inter-metal Dielectric Layers App 20140193961 - Tzeng; Kuo-Chyuan ; et al.	2014-07-10
Method Of Fabricating Metal-insulator-metal (mim) Capacitor Within Topmost Thick Inter-metal Dielectric Layers App 20140191364 - Tzeng; Kuo-Chyuan ; et al.	2014-07-10
Method of manufacturing decoupling MIM capacitor designs for interposers Grant 8,748,284 - Tzeng , et al. June 10, 2	2014-06-10
Method of fabricating metal-insulator-metal (MIM) capacitor within topmost thick inter-metal dielectric layers Grant 8,716,100 - Tzeng , et al. May 6, 2	2014-05-06
Metal-Insulator-Metal Capacitor and Method of Fabricating App 20130043560 - Tzeng; Kuo-Chyuan ; et al.	2013-02-21
Decoupling MIM Capacitor Designs for Interposers and Methods of Manufacture Thereof App 20130037910 - Tzeng; Kuo-Chyuan ; et al.	2013-02-14
One-transistor random access memory technology compatible with metal gate process Grant 7,884,408 - Tu , et al. February 8, 2	2011-02-08
Method of forming contact plugs for eliminating tungsten seam issue App 20080217775 - Pai; Chih-Yang ; et al.	2008-09-11
Semiconductor product including logic, non-volatile memory and volatile memory devices and method for fabrication thereof Grant 7,355,240 - Tu , et al. April 8, 2	2008-04-08
One-Transistor Random Access Memory Technology Compatible with Metal Gate Process App 20080073688 - Tu; Kuo-Chi ; et al.	2008-03-27
One-transistor random access memory technology compatible with metal gate process Grant 7,271,083 - Tu , et al. September 18, 2	2007-09-18
Semiconductor product including logic, non-volatile memory and volatile memory devices and method for fabrication thereof App 20070063251 - Tu; Kuo-Chi ; et al.	2007-03-22
Poly-etching method for split gate flash memory cell Grant 7,101,758 - Lee , et al. September 5, 2	2006-09-05
One-transistor random access memory technology compatible with metal gate process App 20060017115 - Tu; Kuo-Chi ; et al.	2006-01-26
Poly-etching method for split gate flash memory cell App 20050202631 - Lee, Hsiang-Fan ; et al.	2005-09-15
Method of forming a novel composite insulator spacer Grant 6,835,640 - Lee , et al. December 28, 2	2004-12-28
Method of forming a novel composite insulator spacer App 20040110363 - Lee, Hsiang-Fan ; et al.	2004-06-10
Method for fabricating tungsten polycide contacts Grant 5,926,728 - Lee , et al. July 20, 1	1999-07-20

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