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Patent applications and USPTO patent grants for LEE; Hong-Kee.The latest application filed is for "method of improving adhesion between polymer film and metal layer".
Patent | Date |
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Method Of Improving Adhesion Between Polymer Film And Metal Layer App 20150329971 - LEE; Hong-Kee ;   et al. | 2015-11-19 |
Method for Selective Adsorption of Noble Metal Onto Surface of Polymer App 20100307796 - LEE; Hong Kee | 2010-12-09 |
System and method for manufacturing flexible copper clad laminate film Grant 7,678,242 - Lee , et al. March 16, 2 | 2010-03-16 |
System and method for manufacturing flexible copper clad laminate film App 20070032080 - Lee; Hong Kee ;   et al. | 2007-02-08 |
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