LEE; Ho-Shing
Patent Applications and Registrations
Patent applications and USPTO patent grants for LEE; Ho-Shing.The latest application filed is for "circuit substrate with heat dissipation block and packaging structure having the same".
- LEE; Ho-Shing - Taoyuan City TW
- Lee; Ho-Shing - Taoyuan TW
| Patent | Date |
|---|---|
| Circuit Substrate With Heat Dissipation Block And Packaging Structure Having The Same App 20220157687 - LIN; Chien-Chen ; et al. | 2022-05-19 |
| Circuit carrier structure and manufacturing method thereof Grant 11,153,963 - Chen , et al. October 19, 2 | 2021-10-19 |
| Circuit Carrier Structure And Manufacturing Method Thereof App 20210289614 - Chen; Chang-Fu ; et al. | 2021-09-16 |
| Circuit board Grant 10,856,421 - Huang , et al. December 1, 2 | 2020-12-01 |
| Circuit Board App 20200077521 - HUANG; Ching-Hao ; et al. | 2020-03-05 |
| Method for manufacturing a circuit board Grant 10,512,165 - Huang , et al. Dec | 2019-12-17 |
| Circuit Board And Method For Manufacturing The Same App 20180279480 - HUANG; Ching-Hao ; et al. | 2018-09-27 |
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