Lee; Ho Ouk

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Ho Ouk.The latest application filed is for "semiconductor device having a trench type device isolation film and method for fabricating the same".

Company Profile

2.5.5

Lee; Ho Ouk - Seoul KR
Lee; Ho-Ouk - Gyeonggi-do KR
Lee; Ho-Ouk - Ulsan KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device having a trench type device isolation film and method for fabricating the same Grant 10,832,983 - Choi , et al. November 10, 2	2020-11-10
Semiconductor device having air gap spacers and method for fabricating the same Grant 10,204,825 - Lee , et al. Feb	2019-02-12
Semiconductor Device Having A Trench Type Device Isolation Film And Method For Fabricating The Same App 20180166352 - Choi; Ji Min ; et al.	2018-06-14
Semiconductor Device Having Air Gap Spacers And Method For Fabricating The Same App 20180158718 - LEE; DONG RYUL ; et al.	2018-06-07
Method of fabricating semiconductor device by exposing upper sidewalls of contact plug to form charge storage electrode Grant 7,605,035 - Lee , et al. October 20, 2	2009-10-20
Method Of Fabricating Semiconductor Device By Exposing Upper Sidewalls Of Contact Plug To Form Charge Storage Electrode App 20070087562 - Lee; Ho-Ouk ; et al.	2007-04-19
Method of fabricating semiconductor device by exposing upper sidewalls of contact plug to form charge storage electrode Grant 7,132,326 - Lee , et al. November 7, 2	2006-11-07
Semiconductor devices having dual capping layer patterns and methods of manufacturing the same Grant 7,081,389 - Lee , et al. July 25, 2	2006-07-25
Method of fabricating semiconductor device by exposing upper sidewalls of contact plug to form charge storage electrode App 20050130367 - Lee, Ho-Ouk ; et al.	2005-06-16
Semiconductor devices having dual capping layer patterns and methods of manufacturing the same App 20040183101 - Lee, Ho-Ouk ; et al.	2004-09-23

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