| Patent | Date |
|---|
Efficient dropout inference for bayesian deep learning
Grant 11,410,040 - Yoo , et al. August 9, 2 | 2022-08-09 |
Semiconductor device package and apparatus comprising the same
Grant 11,244,936 - Im , et al. February 8, 2 | 2022-02-08 |
Semiconductor package
Grant 11,171,128 - Im , et al. November 9, 2 | 2021-11-09 |
Lane Marker Detection
App 20210287018 - YOO; Seungwoo ; et al. | 2021-09-16 |
Adaptive Multiple Region Of Interest Camera Perception
App 20210192231 - LEE; Hee-Seok ; et al. | 2021-06-24 |
Semiconductor Package
App 20200219860 - Im; Yun Hyeok ; et al. | 2020-07-09 |
Lane Marker Detection And Lane Instance Recognition
App 20200218909 - MYEONG; Heesoo ; et al. | 2020-07-09 |
Bounding Box Estimation And Object Detection
App 20200219316 - BAIK; Young-Ki ; et al. | 2020-07-09 |
Efficient Dropout Inference For Bayesian Deep Learning
App 20200125953 - YOO; Seungwoo ; et al. | 2020-04-23 |
Semiconductor package
Grant 10,607,971 - Im , et al. | 2020-03-31 |
Semiconductor Device Package And Apparatus Comprising The Same
App 20190295998 - IM; Yun Hyeok ; et al. | 2019-09-26 |
Method and device for capturing image of traffic sign
Grant 10,325,339 - Lee , et al. | 2019-06-18 |
Semiconductor Package
App 20190115325 - IM; Yun Hyeok ; et al. | 2019-04-18 |
Simultaneous object detection and rigid transform estimation using neural network
Grant 10,262,218 - Lee , et al. | 2019-04-16 |
Source driver, an image display assembly and an image display apparatus
Grant 10,163,942 - Chung , et al. Dec | 2018-12-25 |
Semiconductor Device Package And Method For Fabricating The Same
App 20180315740 - IM; Yun Hyeok ; et al. | 2018-11-01 |
Simultaneous Object Detection And Rigid Transform Estimation Using Neural Network
App 20180189580 - LEE; Hee-Seok ; et al. | 2018-07-05 |
Text-based image resizing
Grant 10,002,451 - Yoo , et al. June 19, 2 | 2018-06-19 |
Method And Device For Capturing Image Of Traffic Sign
App 20170308989 - Lee; Hee-Seok ; et al. | 2017-10-26 |
Activating flash for capturing images with text
Grant 9,667,880 - Yoo , et al. May 30, 2 | 2017-05-30 |
Source Driver, An Image Display Assembly And An Image Display Apparatus
App 20170092663 - CHUNG; Ye-chung ; et al. | 2017-03-30 |
Source driver, an image display assembly and an image display apparatus
Grant 9,557,616 - Chung , et al. January 31, 2 | 2017-01-31 |
Stacked package structure and method of forming a package-on-package device including an electromagnetic shielding layer
Grant 9,520,387 - Kim , et al. December 13, 2 | 2016-12-13 |
Semiconductor chip and a semiconductor package having a package on package (POP) structure including the semiconductor chip
Grant 9,472,539 - Kim , et al. October 18, 2 | 2016-10-18 |
Text-based Image Resizing
App 20160210768 - Yoo; Seungwoo ; et al. | 2016-07-21 |
Semiconductor package
Grant 9,362,235 - Kim , et al. June 7, 2 | 2016-06-07 |
Semiconductor Chip And A Semiconductor Package Having A Package On Package (pop) Structure Including The Semiconductor Chip
App 20160126229 - Kim; Yong-Hoon ; et al. | 2016-05-05 |
Activating Flash For Capturing Images With Text
App 20160057331 - Yoo; Seungwoo ; et al. | 2016-02-25 |
Cyclic pentadepsipeptide derivative and fusarium strain producing the same
Grant 9,260,485 - Lee , et al. February 16, 2 | 2016-02-16 |
Stack type semiconductor package
Grant 9,171,827 - Lee , et al. October 27, 2 | 2015-10-27 |
Semiconductor device including coupling conductive pattern
Grant 9,165,893 - Kim , et al. October 20, 2 | 2015-10-20 |
Cyclic pentadepsipeptides and microorganism of Fusarium strain producing the same
Grant 9,145,442 - Lee , et al. September 29, 2 | 2015-09-29 |
Cyclic Pentadepsipeptide Derivative And Fusarium Strain Producing The Same
App 20150191507 - Lee; Chan ; et al. | 2015-07-09 |
Semiconductor package with thermal dissipating member and method of manufacturing the same
Grant 9,054,067 - Im , et al. June 9, 2 | 2015-06-09 |
Sealed crystal oscillator and semiconductor package including the same
Grant 9,048,808 - Park , et al. June 2, 2 | 2015-06-02 |
Circuit board, comprising a core insulation film
Grant 8,970,042 - Myung , et al. March 3, 2 | 2015-03-03 |
Stacked Package Structure And Method Of Manufacturing A Package-on-package Device
App 20150024545 - KIM; Yong-Hoon ; et al. | 2015-01-22 |
Cyclic Pentadepsipeptides And Microorganism Of Fusarium Strain Producing The Same
App 20150025219 - Lee; Chan ; et al. | 2015-01-22 |
Semiconductor Chip And A Semiconductor Package Having A Package On Package (pop) Structure Including The Semiconductor Chip
App 20140319701 - Kim; Yong-hoon ; et al. | 2014-10-30 |
Stacked package structure including insulating layer between two stacked packages
Grant 8,872,319 - Kim , et al. October 28, 2 | 2014-10-28 |
Embedded chip-on-chip package and package-on-package comprising same
Grant 8,873,245 - Kim , et al. October 28, 2 | 2014-10-28 |
Stack Type Semiconductor Package
App 20140291868 - LEE; JIN-HO ; et al. | 2014-10-02 |
Sealed Crystal Oscillator And Semiconductor Package Including The Same
App 20140232477 - Park; Jae-Jin ; et al. | 2014-08-21 |
Semiconductor Package
App 20140217576 - Im; Yun- Hyoek ; et al. | 2014-08-07 |
Semiconductor Package
App 20140151859 - Kim; Yong-hoon ; et al. | 2014-06-05 |
Semiconductor Package And Method Of Manufacturing The Same
App 20140124906 - Park; Soo-Jeoung ; et al. | 2014-05-08 |
Semiconductor package
Grant 8,664,751 - Kim , et al. March 4, 2 | 2014-03-04 |
Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same
Grant 8,647,976 - Song , et al. February 11, 2 | 2014-02-11 |
Semiconductor device including shielding layer and fabrication method thereof
Grant 8,587,096 - Kim , et al. November 19, 2 | 2013-11-19 |
Semiconductor package to remove power noise using ground impedance
Grant 8,552,521 - Song , et al. October 8, 2 | 2013-10-08 |
Circuit Board, Method for Fabricating the Same and Semiconductor Package Using the Same
App 20130200531 - Myung; Bok-Sik ; et al. | 2013-08-08 |
Semiconductor package including power ball matrix and power ring having improved power integrity
Grant 8,502,084 - Song , et al. August 6, 2 | 2013-08-06 |
Electronic device having interconnections, openings, and pads having greater width than the openings
Grant 8,466,554 - Park , et al. June 18, 2 | 2013-06-18 |
Semiconductor package
Grant 8,445,996 - Kim , et al. May 21, 2 | 2013-05-21 |
Package On Package Using Through Substrate Vias
App 20130001797 - Choi; Yun-seok ; et al. | 2013-01-03 |
Semiconductor chip, wiring substrate of a semiconductor package, semiconductor package having the semiconductor chip and display device having the semiconductor package
Grant 8,299,597 - Choi , et al. October 30, 2 | 2012-10-30 |
Package on package structure
Grant 8,253,228 - Kim , et al. August 28, 2 | 2012-08-28 |
Stacked Package Structure
App 20120139090 - Kim; Yong-Hoon ; et al. | 2012-06-07 |
Semiconductor Package Having Test Pads On Top And Bottom Substrate Surfaces And Method Of Testing Same
App 20120105089 - SONG; Eun-seok ; et al. | 2012-05-03 |
Semiconductor Device Including Shielding Layer And Fabrication Method Thereof
App 20120086109 - Kim; Yong-Hoon ; et al. | 2012-04-12 |
Circuit Board Including Embedded Decoupling Capacitor And Semiconductor Package Thereof
App 20120080222 - Kim; Yong-Hoon ; et al. | 2012-04-05 |
Source Driver, An Image Display Assembly And An Image Display Apparatus
App 20120075268 - Chung; Ye-Chung ; et al. | 2012-03-29 |
Semiconductor Device Including Coupling Conductive Pattern
App 20120064827 - KIM; Yong-Hoon ; et al. | 2012-03-15 |
Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same
Grant 8,120,024 - Song , et al. February 21, 2 | 2012-02-21 |
Interconnection substrate, semiconductor chip package including the same, and display system including the same
Grant 8,106,425 - Choi , et al. January 31, 2 | 2012-01-31 |
Embedded Chip-on-chip Package And Package-on-package Comprising Same
App 20110317381 - KIM; Yong-hoon ; et al. | 2011-12-29 |
Semiconductor Package Having De-coupling Capacitor
App 20110316119 - KIM; Yong-hoon ; et al. | 2011-12-29 |
Semiconductor Package
App 20110304015 - Kim; Yong-hoon ; et al. | 2011-12-15 |
Image Sensor Chip And Camera Module Having The Same
App 20110304763 - Choi; Mi-Na ; et al. | 2011-12-15 |
Novel Cyclic Pentadepsipeptide Derivative and Fusarium Strain Producing The Same
App 20110269698 - Lee; Chan ; et al. | 2011-11-03 |
Package On Package Structure
App 20110241168 - KIM; YONG-HOON ; et al. | 2011-10-06 |
Electronic Device Having Interconnections And Pads
App 20110227221 - Park; Ji-Yong ; et al. | 2011-09-22 |
Flip chip packages
Grant 7,956,452 - Choi , et al. June 7, 2 | 2011-06-07 |
Substrate for semiconductor package
Grant 7,936,232 - Song , et al. May 3, 2 | 2011-05-03 |
Optical system using optical signal and solid state drive module using the optical signal
App 20110008048 - Kim; Yong-hoon ; et al. | 2011-01-13 |
Semiconductor package including transformer or antenna
Grant 7,868,462 - Choi , et al. January 11, 2 | 2011-01-11 |
Semiconductor Package Including Power Ball Matrix And Power Ring Having Improved Power Integrity
App 20100276189 - Song; Eun seok ; et al. | 2010-11-04 |
Input and output driver circuits for differential signal transfer, and differential signal transfer apparatus and methods
Grant 7,826,551 - Lee , et al. November 2, 2 | 2010-11-02 |
Substrate For Semiconductor Package
App 20100264524 - SONG; Eun-seok ; et al. | 2010-10-21 |
Semiconductor Package To Remove Power Noise Using Ground Impedance
App 20100258905 - Song; Eun-seok ; et al. | 2010-10-14 |
Tape distribution substrate having pattern for reducing EMI
Grant 7,768,103 - Cho , et al. August 3, 2 | 2010-08-03 |
Substrate for semiconductor package
Grant 7,760,044 - Song , et al. July 20, 2 | 2010-07-20 |
Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
App 20100117451 - Jang; Kyung-Lae ; et al. | 2010-05-13 |
Semiconductor package preventing generation of static electricity therein
Grant 7,705,433 - Lee , et al. April 27, 2 | 2010-04-27 |
Flip chip packages
App 20100044851 - Choi; Yun-Seok ; et al. | 2010-02-25 |
Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
Grant 7,663,221 - Jang , et al. February 16, 2 | 2010-02-16 |
Semiconductor Package
App 20100013066 - Kim; Yong-hoon ; et al. | 2010-01-21 |
Semiconductor Chip, Wiring Substrate Of A Semiconductor Package, Semiconductor Package Having The Semiconductor Chip And Display Device Having The Semiconductor Package
App 20100006869 - CHOI; Yun-Seok ; et al. | 2010-01-14 |
Electronic Device Having Electrostatic Discharge Protection Device And Methods Of Fabricating The Same
App 20090284883 - LEE; Hee-Seok ; et al. | 2009-11-19 |
Bonding configurations for lead-frame-based and substrate-based semiconductor packages
Grant 7,566,954 - Jang , et al. July 28, 2 | 2009-07-28 |
Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate
Grant 7,508,680 - Lee , et al. March 24, 2 | 2009-03-24 |
Integrated circuit chip package having a ring-shaped silicon decoupling capacitor
Grant 7,489,035 - Song , et al. February 10, 2 | 2009-02-10 |
Semiconductor package with conductive molding compound and manufacturing method thereof
Grant 7,374,969 - Cho , et al. May 20, 2 | 2008-05-20 |
Semiconductor chip package
Grant 7,372,139 - Lee , et al. May 13, 2 | 2008-05-13 |
Semiconductor chip having coolant path, semiconductor package and package cooling system using the same
Grant 7,372,148 - Im , et al. May 13, 2 | 2008-05-13 |
Multi-ground Shielding Semiconductor Package, Method Of Fabricating The Package, And Method Of Preventing Noise Using Multi-ground Shielding
App 20080099887 - SONG; Eun-Seok ; et al. | 2008-05-01 |
Semiconductor Package Preventing Generation Of Static Electricity Therein
App 20080087988 - Lee; Hee-seok ; et al. | 2008-04-17 |
Semiconductor Package Having Test Pads On Top And Bottom Substrate Surfaces And Method Of Testing Same
App 20080054261 - SONG; Eun-seok ; et al. | 2008-03-06 |
Printed circuit board having a bond wire shield structure for a signal transmission line
Grant 7,330,084 - Lee , et al. February 12, 2 | 2008-02-12 |
Multi-chip package including at least one semiconductor device enclosed therein
Grant 7,327,020 - Kwon , et al. February 5, 2 | 2008-02-05 |
Interconnection substrate, semiconductor chip package including the same, and display system including the same
App 20080023844 - Choi; Yun-seok ; et al. | 2008-01-31 |
Adjustable-inductance Filter, Tape Distribution Substrate Comprising The Filter, And Display Panel Assembly Comprising The Tape Distribution Substrate
App 20080018390 - LEE; Hee-seok ; et al. | 2008-01-24 |
Substrate For Semiconductor Package
App 20070285188 - SONG; Eun-seok ; et al. | 2007-12-13 |
Semiconductor package including transformer or antenna
App 20070194427 - Choi; Yun-Seok ; et al. | 2007-08-23 |
Input and output driver circuits for differential signal transfer, and differential signal transfer apparatus and methods
App 20070071113 - Lee; Hee-Seok ; et al. | 2007-03-29 |
Tape distribution substrate having pattern for reducing EMI
App 20070012774 - Cho; Young-sang ; et al. | 2007-01-18 |
Multi-path printed circuit board having heterogeneous layers and power delivery system including the same
App 20060157826 - Lee; Hee-seok ; et al. | 2006-07-20 |
Semiconductor chip having coolant path, semiconductor package and package cooling system using the same
App 20060131737 - Im; Yun-Hyeok ; et al. | 2006-06-22 |
Printed circuit board having shield structure of signal transmission line
App 20060119448 - Lee; Hee-Seok ; et al. | 2006-06-08 |
Integrated circuit chip package having a ring-shaped silicon decoupling capacitor
App 20060097365 - Song; Eun-Seok ; et al. | 2006-05-11 |
Semiconductor package with conductive molding compound and manufacturing method thereof
App 20060097404 - Cho; Byeong-Yeon ; et al. | 2006-05-11 |
Temperature measuring device using a matrix switch, a semiconductor package and a cooling system
App 20060075760 - Im; Yun-Hyeok ; et al. | 2006-04-13 |
Bonding configurations for lead-frame-based and substrate-based semiconductor packages and method of fabrication thereof
App 20060017142 - Jang; Kyung Lae ; et al. | 2006-01-26 |
Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
App 20050242426 - Kwon, Heung-Kyu ; et al. | 2005-11-03 |
Semiconductor chip package
App 20050230852 - Lee, Hee-seok ; et al. | 2005-10-20 |
Multi-chip package
App 20050200003 - Yoon, Ki-myung ; et al. | 2005-09-15 |
Multi-chip package, a semiconductor device used therein and manufacturing method thereof
App 20050194673 - Kwon, Heung-Kyu ; et al. | 2005-09-08 |
Package circuit board and package including a package circuit board and method thereof
App 20050146018 - Jang, Kyung-Lae ; et al. | 2005-07-07 |
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