Lee; Han-Hsiang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Han-Hsiang.The latest application filed is for "package structure and manufacturing method thereof".
- Lee; Han-Hsiang - Taipei TW
- - Taipei TW
- Lee; Han-Hsiang - Taipei City TW
| Patent | Date |
|---|---|
| Package structure and manufacturing method thereof Grant 9,735,091 - Lee , et al. August 15, 2 | 2017-08-15 |
| Electronic system with a composite substrate Grant 9,484,290 - Lee , et al. November 1, 2 | 2016-11-01 |
| Package Structure And Manufacturing Method Thereof App 20150102475 - Lee; Han-Hsiang ; et al. | 2015-04-16 |
| Package structure and manufacturing method thereof Grant 9,000,576 - Lee , et al. April 7, 2 | 2015-04-07 |
| Electronic package structure Grant 8,619,428 - Lee , et al. December 31, 2 | 2013-12-31 |
| Electronic package structure Grant 08619428 - | 2013-12-31 |
| Electronic System With A Composite Substrate App 20130328181 - Lee; Han-Hsiang ; et al. | 2013-12-12 |
| Electronic system with a composite substrate Grant 8,547,709 - Lee , et al. October 1, 2 | 2013-10-01 |
| Package Structure And Manufacturing Method Thereof App 20120313229 - Lee; Han-Hsiang ; et al. | 2012-12-13 |
| MOSFET pair with stack capacitor and manufacturing method thereof Grant 8,269,330 - Lee , et al. September 18, 2 | 2012-09-18 |
| Electronic Package Structure App 20120075808 - LEE; Han-Hsiang ; et al. | 2012-03-29 |
| Electronic System With A Composite Substrate App 20110199746 - LEE; Han-Hsiang ; et al. | 2011-08-18 |
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