loadpatents
Patent applications and USPTO patent grants for Lee; Haksun.The latest application filed is for "method of fabricating a semiconductor package".
Patent | Date |
---|---|
Method of fabricating a semiconductor package Grant 9,853,010 - Choi , et al. December 26, 2 | 2017-12-26 |
Method Of Fabricating A Semiconductor Package App 20170141071 - CHOI; Kwang-Seong ;   et al. | 2017-05-18 |
Bonding structure of electronic equipment Grant 9,538,666 - Choi , et al. January 3, 2 | 2017-01-03 |
Semiconductor Package And Method For Manufacturing The Same App 20160358892 - LEE; Haksun ;   et al. | 2016-12-08 |
Transceiver Module And Communication Apparatus Including The Same App 20160094258 - BAE; Hyun-cheol ;   et al. | 2016-03-31 |
Stack Module Package And Method For Manufacturing The Same App 20150364445 - CHOI; Kwang Seong ;   et al. | 2015-12-17 |
Semiconductor Device And Method Of Manufacturing The Same App 20150228617 - LEE; Haksun ;   et al. | 2015-08-13 |
Methods of forming bump and semiconductor device with the same Grant 9,006,037 - Choi , et al. April 14, 2 | 2015-04-14 |
Bonding Structure Of Electronic Equipment App 20150043175 - CHOI; KWANG-SEONG ;   et al. | 2015-02-12 |
Method Of Fabricating A Solder Particle App 20140367375 - BAE; Hyun-cheol ;   et al. | 2014-12-18 |
Methods Of Forming Bump And Semiconductor Device With The Same App 20140287556 - CHOI; Kwang-Seong ;   et al. | 2014-09-25 |
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