Lee; Haksun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Haksun.The latest application filed is for "method of fabricating a semiconductor package".
- Lee; Haksun - Daejeon KR
- Lee; Haksun - Seoul KR
| Patent | Date |
|---|---|
| Method of fabricating a semiconductor package Grant 9,853,010 - Choi , et al. December 26, 2 | 2017-12-26 |
| Method Of Fabricating A Semiconductor Package App 20170141071 - CHOI; Kwang-Seong ; et al. | 2017-05-18 |
| Bonding structure of electronic equipment Grant 9,538,666 - Choi , et al. January 3, 2 | 2017-01-03 |
| Semiconductor Package And Method For Manufacturing The Same App 20160358892 - LEE; Haksun ; et al. | 2016-12-08 |
| Transceiver Module And Communication Apparatus Including The Same App 20160094258 - BAE; Hyun-cheol ; et al. | 2016-03-31 |
| Stack Module Package And Method For Manufacturing The Same App 20150364445 - CHOI; Kwang Seong ; et al. | 2015-12-17 |
| Semiconductor Device And Method Of Manufacturing The Same App 20150228617 - LEE; Haksun ; et al. | 2015-08-13 |
| Methods of forming bump and semiconductor device with the same Grant 9,006,037 - Choi , et al. April 14, 2 | 2015-04-14 |
| Bonding Structure Of Electronic Equipment App 20150043175 - CHOI; KWANG-SEONG ; et al. | 2015-02-12 |
| Method Of Fabricating A Solder Particle App 20140367375 - BAE; Hyun-cheol ; et al. | 2014-12-18 |
| Methods Of Forming Bump And Semiconductor Device With The Same App 20140287556 - CHOI; Kwang-Seong ; et al. | 2014-09-25 |
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