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Integrated Circuit Devices Including Enlarged Via And Fully Aligned Metal Wire And Methods Of Forming The Same App 20220108920 - Bae; Tae Yong ;   et al. | 2022-04-07 |
Integrated circuit devices including enlarged via and fully aligned metal wire and methods of forming the same Grant 11,232,986 - Bae , et al. January 25, 2 | 2022-01-25 |
Integrated Circuit Devices Including Enlarged Via And Fully Aligned Metal Wire And Methods Of Forming The Same App 20210111070 - BAE; Tae Yong ;   et al. | 2021-04-15 |
Method for forming a fine pattern Grant 10,600,653 - Bai , et al. | 2020-03-24 |
Method For Forming A Fine Pattern App 20190267246 - BAI; KeunHee ;   et al. | 2019-08-29 |
Planarized interlayer dielectric with air gap isolation Grant 10,186,485 - Nguyen , et al. Ja | 2019-01-22 |
Planarized Interlayer Dielectric With Air Gap Isolation App 20180174977 - Nguyen; VietHa ;   et al. | 2018-06-21 |
Planarized interlayer dielectric with air gap isolation Grant 9,929,099 - Nguyen , et al. March 27, 2 | 2018-03-27 |
Planarized Interlayer Dielectric With Air Gap Isolation App 20170170184 - Nguyen; VietHa ;   et al. | 2017-06-15 |
Semiconductor device, electronic device including the same and manufacturing methods thereof Grant 9,312,181 - Choi , et al. April 12, 2 | 2016-04-12 |
Magnetic devices and methods of manufacturing the same Grant 9,312,478 - Lee , et al. April 12, 2 | 2016-04-12 |
Semiconductor device and method of fabricating the same Grant 9,190,404 - Lee , et al. November 17, 2 | 2015-11-17 |
Semiconductor Device, Electronic Device Including The Same And Manufacturing Methods Thereof App 20150162247 - CHOI; Yong-Joon ;   et al. | 2015-06-11 |
Non-volatile semiconductor devices and methods of manufacturing non-volatile semiconductor devices Grant 8,669,622 - Lee , et al. March 11, 2 | 2014-03-11 |
Semiconductor Device And Method Of Fabricating The Same App 20140035048 - Lee; Hak-Sun ;   et al. | 2014-02-06 |
Magnetic Devices And Methods Of Manufacturing The Same App 20130149499 - LEE; Hak-sun ;   et al. | 2013-06-13 |
Methods of manufacturing charge trap-type non-volatile memory devices Grant 8,178,408 - Lee , et al. May 15, 2 | 2012-05-15 |
Non-volatile Semiconductor Devices And Methods Of Manufacturing Non-volatile Semiconductor Devices App 20110233653 - LEE; Hak-Sun ;   et al. | 2011-09-29 |
Method of manufacturing non-volatile semiconductor devices Grant 8,003,469 - Lee , et al. August 23, 2 | 2011-08-23 |
Method for forming hard mask patterns having a fine pitch and method for forming a semiconductor device using the same Grant 7,998,874 - Lee , et al. August 16, 2 | 2011-08-16 |
Method of forming fine patterns of semiconductor devices using double patterning Grant 7,935,635 - Jeon , et al. May 3, 2 | 2011-05-03 |
Methods Of Manufacturing Charge Trap-type Non-volatile Memory Devices App 20100173469 - Lee; Hak-Sun ;   et al. | 2010-07-08 |
Method Of Manufacturing Non-volatile Semiconductor Devices App 20100112768 - LEE; Hak-Sun ;   et al. | 2010-05-06 |
Method of forming fine patterns of semiconductor device using double patterning Grant 7,601,647 - Jeon , et al. October 13, 2 | 2009-10-13 |
Method of forming pattern using fine pitch hard mask Grant 7,576,010 - Lee , et al. August 18, 2 | 2009-08-18 |
Method for forming fine patterns of a semiconductor device using double patterning Grant 7,550,391 - Jeon , et al. June 23, 2 | 2009-06-23 |
Method of forming fine patterns of semiconductor devices using double patterning App 20080220611 - Jeon; Kyung-yub ;   et al. | 2008-09-11 |
Method of forming fine patterns of semiconductor device using double patterning App 20080188083 - Jeon; Kyung-yub ;   et al. | 2008-08-07 |
Method for forming hard mask patterns having a fine pitch and method for forming a semiconductor device using the same App 20080131793 - Lee; Hak-sun ;   et al. | 2008-06-05 |
Method for forming fine patterns of a semiconductor device using double patterning App 20080090418 - Jeon; Kyung-yub ;   et al. | 2008-04-17 |
Method of forming pattern using fine pitch hard mask App 20070123037 - Lee; Ji-young ;   et al. | 2007-05-31 |