LEE; Hai Joon

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Hai Joon.The latest application filed is for "multilayer capacitor".

Company Profile

4.24.35

LEE; Hai Joon - Suwon-si KR
Lee; Hai Joon - Gwangju-si KR
Lee; Hai Joon - Gyunggi-do KR
LEE; Hai Joon - Suwon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multilayer Capacitor App 20220172898 - LEE; Jang Yeol ; et al.	2022-06-02
Capacitor component Grant 11,094,460 - Yang , et al. August 17, 2	2021-08-17
Capacitor Component App 20200066444 - Yang; Jeong Suong ; et al.	2020-02-27
Multilayer ceramic capacitor having via electrode and method of manufacturing the same Grant 10,553,363 - Park , et al. Fe	2020-02-04
Thin film capacitor and manufacturing method thereof Grant 10,490,355 - Lim , et al. Nov	2019-11-26
Thin film capacitor Grant 10,446,324 - Lee , et al. Oc	2019-10-15
Thin film capacitor and manufacturing method thereof Grant 10,395,842 - Lee , et al. A	2019-08-27
Monolayer thin film capacitor and method for manufacturing the same Grant 10,355,074 - Lee , et al. July 16, 2	2019-07-16
Thin-film capacitor Grant 10,319,526 - Shin , et al.	2019-06-11
Thin film type capacitor element and method of manufacturing the same Grant 10,199,171 - Lim , et al. Fe	2019-02-05
Coil component and method of manufacturing the same Grant 10,192,672 - Yang , et al. Ja	2019-01-29
Thin film capacitor including alternatively disposed dielectric layers having different thicknesses Grant 10,141,115 - Lee , et al. Nov	2018-11-27
Thin-film ceramic capacitor Grant 10,062,516 - Kang , et al. August 28, 2	2018-08-28
Multilayer Ceramic Electronic Component To Be Embedded In Board And Printed Circuit Board Having Multilayer Ceramic Electronic Component Embedded Therein App 20180211776 - LEE; Byoung Hwa ; et al.	2018-07-26
Monolayer Thin Film Capacitor And Method For Manufacturing The Same App 20180166528 - LEE; Jong Pil ; et al.	2018-06-14
Capacitor element and method of manufacturing the same Grant 9,984,823 - Lim , et al. May 29, 2	2018-05-29
Thin-film Capacitor App 20180144872 - SHIN; Hyun Ho ; et al.	2018-05-24
Thin Film Capacitor App 20180144873 - LEE; Kyo Yeol ; et al.	2018-05-24
Thin-film Ceramic Capacitor App 20180144871 - KANG; Yun Sung ; et al.	2018-05-24
Electronic component and method of manufacturing the same Grant 9,929,231 - Lee , et al. March 27, 2	2018-03-27
Monolayer thin film capacitor Grant 9,923,048 - Lee , et al. March 20, 2	2018-03-20
Thin Film Capacitor App 20180068798 - LEE; Kyo Yeol ; et al.	2018-03-08
Thin Film Capacitor And Manufacturing Method Thereof App 20180061581 - LEE; Kyo Yeol ; et al.	2018-03-01
Multilayer Ceramic Electronic Component To Be Embedded In Board And Printed Circuit Board Having Multilayer Ceramic Electronic Component Embedded Therein App 20180033552 - LEE; Byoung Hwa ; et al.	2018-02-01
Thin-film Capacitor And Method Of Manufacturing The Same App 20170338042 - SHIN; Hyun Ho ; et al.	2017-11-23
Thin Film Capacitor And Manufacturing Method Thereof App 20170330688 - LIM; Seung Mo ; et al.	2017-11-16
Multilayer Ceramic Capacitor And Method Of Manufacturing The Same App 20170278637 - PARK; Ji Hyun ; et al.	2017-09-28
Monolayer Thin Film Capacitor And Method For Manufacturing The Same App 20170250244 - LEE; Jong Pil ; et al.	2017-08-31
Thin Film Type Capacitor Element And Method Of Manufacturing The Same App 20170200559 - LIM; Jong Bong ; et al.	2017-07-13
Electronic Component And Method Of Manufacturing The Same App 20170194419 - LEE; Hai Joon ; et al.	2017-07-06
Embedded multilayer ceramic electronic component and printed circuit board having the same Grant 9,642,260 - Lee , et al. May 2, 2	2017-05-02
Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein Grant 9,607,762 - Lee , et al. March 28, 2	2017-03-28
Coil Component And Method Of Manufacturing The Same App 20170062121 - YANG; Ju Hwan ; et al.	2017-03-02
Embedded multilayer ceramic electronic component and printed circuit board having the same Grant 9,424,989 - Kim , et al. August 23, 2	2016-08-23
Multilayer ceramic capacitor and board with the same mounted thereon Grant 9,390,859 - Choi , et al. July 12, 2	2016-07-12
Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein Grant 9,390,852 - Lee , et al. July 12, 2	2016-07-12
Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein Grant 9,324,500 - Lee , et al. April 26, 2	2016-04-26
Multilayer ceramic capacitor and board with the same mounted thereon Grant 9,287,047 - Choi , et al. March 15, 2	2016-03-15
Thin Film Type Capacitor Element And Method Of Manufacturing The Same App 20150380167 - LIM; Jong Bong ; et al.	2015-12-31
Multilayer Ceramic Electronic Component To Be Embedded In Board, Manufacturing Method Thereof And Printed Circuit Board Having The Same Embedded Therein App 20150380161 - LIM; Jong Bong ; et al.	2015-12-31
Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein Grant 9,226,401 - Lee , et al. December 29, 2	2015-12-29
Multi-layered Capacitor And Manufacturing Method For The Same App 20150371779 - LIM; Jong-Bong ; et al.	2015-12-24
Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein Grant 9,198,297 - Lee , et al. November 24, 2	2015-11-24
Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein Grant 9,173,294 - Lee , et al. October 27, 2	2015-10-27
Multilayer Ceramic Capacitor And Board With The Same Mounted Thereon App 20150213956 - CHOI; Young Don ; et al.	2015-07-30
Multilayer Ceramic Capacitor And Board With The Same Mounted Thereon App 20150213957 - CHOI; Young Don ; et al.	2015-07-30
Multilayer Ceramic Electronic Component To Be Embedded In Board And Printed Circuit Board Having Multilayer Ceramic Electronic Component Embedded Therein App 20150122535 - LEE; Hai Joon ; et al.	2015-05-07
Embedded Multilayer Ceramic Electronic Component And Printed Circuit Board Having The Same App 20150098202 - LEE; Byoung Hwa ; et al.	2015-04-09
Multilayer Ceramic Electronic Component Embedded In Board And Printed Circuit Board Having The Same App 20150075853 - LEE; Hai Joon ; et al.	2015-03-19
Multilayer Ceramic Electronic Part To Be Embedded In Board And Printed Circuit Board Having Multilayer Ceramic Electronic Part Embedded Therein App 20150060121 - LEE; Hai Joon ; et al.	2015-03-05
Embedded Multilayer Ceramic Electronic Component And Printed Circuit Board Having The Same App 20150053472 - LEE; Jin Woo ; et al.	2015-02-26
Multilayer Ceramic Electronic Part To Be Embedded In Board And Printed Circuit Board Having Multilayer Ceramic Electronic Part Embedded Therein App 20150053471 - LEE; Hai Joon ; et al.	2015-02-26
Embedded Multilayer Ceramic Electronic Component And Printed Circuit Board Having The Same App 20150041197 - Lee; Byoung Hwa ; et al.	2015-02-12
Embedded Multilayer Ceramic Electronic Component And Printed Circuit Board Having The Same App 20150041196 - KIM; Hye Seong ; et al.	2015-02-12
Multilayer Ceramic Electronic Part To Be Embedded In Board And Printed Circuit Board Having Multilayer Ceramic Electronic Part Embedded Therein App 20150041198 - LEE; Byoung Hwa ; et al.	2015-02-12
Multilayer Ceramic Electronic Component To Be Embedded In Board And Printed Circuit Board Having Multilayer Ceramic Electronic Component Embedded Therein App 20150041199 - LEE; Byoung Hwa ; et al.	2015-02-12
Multilayer Ceramic Electronic Component To Be Embedded In Board And Printed Circuit Board Having Multilayer Ceramic Electronic Component Embedded Therein App 20150021079 - LEE; Byoung Hwa ; et al.	2015-01-22
Multilayer Ceramic Electronic Part To Be Embedded In Board And Printed Circuit Board Having Multilayer Ceramic Electronic Part Embedded Therein App 20150021080 - LEE; Byoung Hwa ; et al.	2015-01-22
Embedded Multilayer Ceramic Electronic Component And Method Of Manufacturing The Same, And Printed Circuit Board Having Embedded Multilayer Ceramic Electronic Component Therein App 20140151101 - LEE; Hai Joon ; et al.	2014-06-05

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