LEE; Haejin

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Haejin.The latest application filed is for "electronic device including noise inducing structure".

Company Profile

10.10.19

LEE; Haejin - Suwon-si KR
LEE; Haejin - Gyeonggi-do KR
LEE; Haejin - Seoul KR
LEE; Haejin - Gyeonggl-do KR
Lee; Haejin - Seongnam-si N/A KR
Lee; HaeJin - Daejeon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Device Including Noise Inducing Structure App 20220173500 - LEE; Haejin ; et al.	2022-06-02
Electronic Device Including Heat Radiating Member App 20220163809 - LEE; Jungkeun ; et al.	2022-05-26
Electronic device comprising heat transfer member having metal plate and heat transfer material coupled thereto Grant 11,304,337 - Lee , et al. April 12, 2	2022-04-12
Electronic Device Filled With Phase Change Material Between Plurality Of Circuit Boards Connected By Connecting Members App 20210392736 - KOO; Kyungha ; et al.	2021-12-16
Electronic Device Having Heat Collection/diffusion Structure App 20210341229 - LEE; Haejin ; et al.	2021-11-04
Electronic device having heat collection/diffusion structure Grant 11,098,959 - Lee , et al. August 24, 2	2021-08-24
Electromagnetic-wave-shielding Sheet Capable Of Dissipating Heat Of Electronic Component And Electronic Device Including The Same App 20210251110 - LEE; Haejin ; et al.	2021-08-12
Electronic Device Including Mmwave Antenna Module App 20210249760 - KIM; Younghoon ; et al.	2021-08-12
Electronic device having heat collection/diffusion structure Grant 11,047,628 - Lee , et al. June 29, 2	2021-06-29
Method For Controlling Cooling Fan And Wireless Charging Device App 20210161034 - JEONG; Chihwan ; et al.	2021-05-27
Electronic Device Having Heat Collection/diffusion Structure App 20210055059 - LEE; Haejin ; et al.	2021-02-25
Electronic Device Comprising Heat Transfer Member Having Metal Plate And Heat Transfer Material Coupled Thereto App 20200389999 - LEE; Haejin ; et al.	2020-12-10
Electronic device having heat collection/diffusion structure Grant 10,798,849 - Lee , et al. October 6, 2	2020-10-06
Electronic device including shielding member connected to conductive plate covering opening of shield can Grant 10,757,846 - Lee , et al. A	2020-08-25
Electronic Device Having Heat Collection/diffusion Structure App 20200116435 - LEE; Haejin ; et al.	2020-04-16
Heat Dissipation Device Formed Of Nonmetallic Material And Electronic Device Including The Same App 20200100390 - KOO; Kyungha ; et al.	2020-03-26
Electronic Device Including Shielding Member Connected To Conductive Plate Covering Opening Of Shield Can App 20200053919 - LEE; Haejin ; et al.	2020-02-13
Electronic Device Having Heat Collection/diffusion Structure App 20190364695 - LEE; Haejin ; et al.	2019-11-28
Messaging service system and method for expanding member addition operation Grant 9,876,654 - Lee , et al. January 23, 2	2018-01-23
System and method based on use information obtained from a user terminal Grant 9,489,686 - Lee , et al. November 8, 2	2016-11-08
Efficiency improved envelope amplifier using dual switching amplifiers Grant 8,896,375 - Park , et al. November 25, 2	2014-11-25
System And Method For Providing Ranking Information Of Mobile Application App 20130232256 - LEE; Haejin ; et al.	2013-09-05
System And Method Based On Use Information Obtained From A User Terminal App 20130232183 - LEE; Haejin ; et al.	2013-09-05
Efficiency Improved Envelope Amplifier Using Dual Switching Amplifiers App 20130222062 - PARK; ChulSoon ; et al.	2013-08-29
Messaging Service System And Method For Expanding Member Addition Operation App 20120311052 - LEE; Haejin ; et al.	2012-12-06

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