Lee, H. W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee, H. W..The latest application filed is for "method of removing alf defects after pad etching process".
- Lee, H. W. - Feng-Shan City TW
- Lee, H. W. - Hsinchu TW
| Patent | Date |
|---|---|
| Method of removing HDP oxide deposition App 20040023501 - Lee, H. W. ; et al. | 2004-02-05 |
| Method of removing ALF defects after pad etching process App 20040023505 - Su, Yen-Huei ; et al. | 2004-02-05 |
| Solvent stripper for removing polymer residue and method of using the same App 20040014628 - Wu, Ching-Ping ; et al. | 2004-01-22 |
| Eliminating residual polymer in the cleaning process of post pad etching App 20030196681 - Wu, Ching-Ping ; et al. | 2003-10-23 |
| Method of removing photo-resist and polymer residue App 20030181055 - Wu, Ching-Ping ; et al. | 2003-09-25 |
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