Lee; Eung Ju

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Eung Ju.The latest application filed is for "method of preparing positive electrode active material precursor for lithium secondary battery and positive electrode active material precursor prepared by the method".

Company Profile

3.4.7

Lee; Eung Ju - Cheongju KR
Lee; Eung Ju - Daejeon KR
Lee; Eung Ju - Cheongju-si KR
Lee; Eung Ju - Gumi-si KR
LEE; Eung Ju - Cheongju-si Chungcheongbuk-do KR
Lee; Eung Ju - Seoul KR
Lee; Eung Ju - Chungcheongbuk-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package Grant 11,404,347 - Kim , et al. August 2, 2	2022-08-02
Method of Preparing Positive Electrode Active Material Precursor for Lithium Secondary Battery and Positive Electrode Active Material Precursor Prepared by the Method App 20220123298 - Lee; Eung Ju ; et al.	2022-04-21
Chip package with connection portion that passes through an encapsulation portion Grant 11,264,330 - Kwon , et al. March 1, 2	2022-03-01
Method of Preparing Positive Electrode Active Material Precursor and Positive Electrode Active Material Precursor App 20220006084 - Lee; Eung Ju ; et al.	2022-01-06
Wafer with beveled edge region and method for analyzing shape of the same Grant 11,056,403 - Lee , et al. July 6, 2	2021-07-06
Chip Package And Manufacturing Method Thereof App 20210151379 - KWON; Yongtae ; et al.	2021-05-20
Semiconductor Package App 20210066154 - Kim; Nam Chul ; et al.	2021-03-04
Wafer And Method For Analyzing Shape Of The Same App 20190131192 - LEE; Woo Sung ; et al.	2019-05-02
Method Of Manufacturing Cathode Active Material For Lithium Secondary Battery And Lithium Secondary Battery Manufactured Using The Same App 20160079595 - SUN; Yang-Kook ; et al.	2016-03-17
Bump structure and fabrication method thereof Grant 8,237,276 - Song , et al. August 7, 2	2012-08-07
Bump Structure And Fabrication Method Thereof App 20110285015 - Song; Chi Jung ; et al.	2011-11-24

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