Lee; Eun Heay
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Eun Heay.The latest application filed is for "substrate with electronic component embedded therein".
- Lee; Eun Heay - Suwon-si KR
- Lee; Eun Heay - Suwon KR
| Patent | Date |
|---|---|
| Substrate With Electronic Component Embedded Therein App 20220022310 - Park; Chang Hwa ; et al. | 2022-01-20 |
| Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board Grant 8,946,911 - Pang , et al. February 3, 2 | 2015-02-03 |
| Printed Circuit Board And Manufacturing Method Thereof App 20150027760 - CHO; Seong Min ; et al. | 2015-01-29 |
| Electrode Pad, Printed Circuit Board Using The Same, And Method Of Manufacturing Printed Circuit Board App 20140087205 - PANG; Jung Youn ; et al. | 2014-03-27 |
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