loadpatents
Patent applications and USPTO patent grants for LEE; Eng Kiat.The latest application filed is for "short interconnect assembly with strip elastomer".
Patent | Date |
---|---|
Short Interconnect Assembly With Strip Elastomer App 20220151063 - FOONG; Wei Kuong ;   et al. | 2022-05-12 |
Short interconnect assembly with strip elastomer Grant 11,266,015 - Foong , et al. March 1, 2 | 2022-03-01 |
Short Interconnect Assembly With Strip Elastomer App 20210392746 - FOONG; Wei Kuong ;   et al. | 2021-12-16 |
Wedged Contact Fingers For Integrated Circuit Testing Apparatus App 20200393511 - FOONG; Wei Kuong ;   et al. | 2020-12-17 |
Low inductance electrical contact assembly manufacturing process Grant 10,830,812 - Foong , et al. November 10, 2 | 2020-11-10 |
Horizontal clamp electrical contact assembly Grant 10,826,217 - Foong , et al. November 3, 2 | 2020-11-03 |
Short contact with multifunctional elastomer Grant 10,578,645 - Foong , et al. | 2020-03-03 |
Short Contact With Multifunctional Elastomer App 20200064371 - FOONG; Wei Kuong ;   et al. | 2020-02-27 |
Kelvin contact assembly and method of installation thereof Grant 10,527,646 - Foong , et al. J | 2020-01-07 |
Compressible layer with integrated bridge in IC testing apparatus Grant 10,488,439 - Foong , et al. Nov | 2019-11-26 |
High precision vertical motion kelvin contact assembly Grant 10,466,300 - Foong , et al. No | 2019-11-05 |
Spring contact in a testing apparatus for integrated circuits Grant 10,446,965 - Foong , et al. Oc | 2019-10-15 |
Horizontal Clamp Electrical Contact Assembly App 20190267738 - FOONG; Wei Kuong ;   et al. | 2019-08-29 |
Low Inductance Electrical Contact Assembly App 20190067861 - FOONG; Wei Kuong ;   et al. | 2019-02-28 |
Low Inductance Electrical Contact Assembly Manufacturing Process App 20190064260 - FOONG; Wei Kuong ;   et al. | 2019-02-28 |
High Precision Vertical Motion Kelvin Contact Assembly App 20180335473 - FOONG; Wei Kuong ;   et al. | 2018-11-22 |
Manufacturing Process For Kelvin Contact Assembly Housing App 20180337505 - FOONG; Wei Kuong ;   et al. | 2018-11-22 |
Compressible Layer With Integrated Bridge In Ic Testing Apparatus App 20180328963 - FOONG; Wei Kuong ;   et al. | 2018-11-15 |
Short Contact With Multifunctional Elastomer App 20180313869 - FOONG; Wei Kuong ;   et al. | 2018-11-01 |
Compressible layer with integrated bridge in IC testing apparatus Grant 10,031,163 - Foong , et al. July 24, 2 | 2018-07-24 |
Short contact in a testing apparatus for wireless integrated circuits Grant 10,018,652 - Foong , et al. July 10, 2 | 2018-07-10 |
Kelvin contact assembly in a testing apparatus for integrated circuits Grant 10,018,653 - Foong , et al. July 10, 2 | 2018-07-10 |
Kelvin Contact Assembly And Method Of Installation Thereof App 20170242055 - FOONG; Wei Kuong ;   et al. | 2017-08-24 |
Spring Contact In A Testing Apparatus For Integrated Circuits App 20170244189 - FOONG; Wei Kuong ;   et al. | 2017-08-24 |
Kelvin Contact Assembly In A Testing Apparatus For Integrated Circuits App 20170219624 - FOONG; Wei Kuong ;   et al. | 2017-08-03 |
Contact assembly in a testing apparatus for integrated circuits Grant 9,658,253 - Foong , et al. May 23, 2 | 2017-05-23 |
Contact Assembly In A Testing Apparatus For Integrated Circuits App 20160178692 - FOONG; Wei Kuong ;   et al. | 2016-06-23 |
Short Contact In A Testing Apparatus For Wireless Integrated Circuits App 20160079707 - FOONG; Wei Kuong ;   et al. | 2016-03-17 |
Electrical interconnect assembly Grant 9,140,721 - Foong , et al. September 22, 2 | 2015-09-22 |
Electrical Interconnect Assembly App 20150212111 - FOONG; Wei Kuong ;   et al. | 2015-07-30 |
Compressible Layer With Integrated Bridge In Ic Testing Apparatus App 20150168451 - FOONG; Wei Kuong ;   et al. | 2015-06-18 |
Electrical interconnect assembly Grant 8,952,714 - Foong , et al. February 10, 2 | 2015-02-10 |
Electrical Interconnect Assembly App 20140127953 - Foong; Wei Kuong ;   et al. | 2014-05-08 |
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