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Patent applications and USPTO patent grants for Lee; Eddie C..The latest application filed is for "planarization of silicon semiconductor devices".
Patent | Date |
---|---|
Planarization of silicon semiconductor devices Grant 4,732,658 - Lee March 22, 1 | 1988-03-22 |
Dielectric barrier material Grant 4,717,449 - Erie , et al. January 5, 1 | 1988-01-05 |
High efficiency metal lift-off process Grant 4,662,989 - Casey , et al. May 5, 1 | 1987-05-05 |
Step shape tailoring by phase angle variation RF bias sputtering Grant 4,584,079 - Lee , et al. April 22, 1 | 1986-04-22 |
SEC | 0001207687 | LEE EDDIE C |
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