| Patent | Date |
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Semiconductor Device
App 20220285518 - CHO; Nam Gyu ; et al. | 2022-09-08 |
Semiconductor device
Grant 11,367,651 - Chung , et al. June 21, 2 | 2022-06-21 |
Semiconductor device
Grant 11,349,007 - Cho , et al. May 31, 2 | 2022-05-31 |
Semiconductor Device
App 20210210613 - CHO; Nam Gyu ; et al. | 2021-07-08 |
Semiconductor Device
App 20210020500 - Chung; Won Keun ; et al. | 2021-01-21 |
Semiconductor devices including contact structures that partially overlap silicide layers
Grant 10,403,717 - Lee , et al. Sep | 2019-09-03 |
Integrated circuit device
Grant 10,262,937 - Lee , et al. | 2019-04-16 |
Semiconductor devices including active fins and methods of manufacturing the same
Grant 10,242,917 - Kim , et al. | 2019-03-26 |
Semiconductor devices including active areas with increased contact area
Grant 10,128,245 - Lee , et al. November 13, 2 | 2018-11-13 |
Integrated circuit device and method of fabricating the same
Grant 10,079,210 - Lee , et al. September 18, 2 | 2018-09-18 |
Integrated Circuit Device
App 20180261540 - LEE; Joon-gon ; et al. | 2018-09-13 |
Semiconductor Devices Including Active Areas with Increased Contact Area
App 20180090495 - LEE; Do Sun ; et al. | 2018-03-29 |
Semiconductor Devices Including Contact Structures That Partially Overlap Silicide Layers
App 20170352728 - Lee; Do-Sun ; et al. | 2017-12-07 |
Semiconductor Devices Including Active Fins And Methods Of Manufacturing The Same
App 20170294355 - KIM; Dong-Woo ; et al. | 2017-10-12 |
Semiconductor devices including contact structures that partially overlap silicide layers
Grant 9,768,255 - Lee , et al. September 19, 2 | 2017-09-19 |
Semiconductor devices including active fins and methods of manufacturing the same
Grant 9,728,601 - Kim , et al. August 8, 2 | 2017-08-08 |
Integrated Circuit Device And Method Of Fabricating The Same
App 20170103948 - LEE; Do-sun ; et al. | 2017-04-13 |
Integrated circuit device having through-silicon-via structure
Grant 9,496,218 - Lee , et al. November 15, 2 | 2016-11-15 |
Semiconductor Devices Including Contact Structures That Partially Overlap Silicide Layers
App 20160308004 - LEE; Do-Sun ; et al. | 2016-10-20 |
Semiconductor Devices Including Active Fins And Methods Of Manufacturing The Same
App 20160293697 - KIM; Dong-Woo ; et al. | 2016-10-06 |
Semiconductor devices having through silicon vias and methods of fabricating the same
Grant 9,006,902 - Choi , et al. April 14, 2 | 2015-04-14 |
Integrated circuit device including through-silicon via structure having offset interface
Grant 8,884,440 - Kim , et al. November 11, 2 | 2014-11-11 |
Electrode connecting structures containing copper
Grant 8,860,221 - Park , et al. October 14, 2 | 2014-10-14 |
Semiconductor Devices Having Through Silicon Vias and Methods of Fabricating the Same
App 20140217559 - CHOI; JU-IL ; et al. | 2014-08-07 |
Semiconductor Device Including Tsv And Semiconductor Package Including The Same
App 20140138819 - Choi; Ju-il ; et al. | 2014-05-22 |
Integrated Circuit Device Having Through-Silicon-Via Structure and Method of Manufacturing the Same
App 20140021633 - Lee; Do-Sun ; et al. | 2014-01-23 |
Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same
Grant 8,497,157 - Moon , et al. July 30, 2 | 2013-07-30 |
Electrode Connecting Structures Containing Copper
App 20130140697 - Park; Kun-Sang ; et al. | 2013-06-06 |
Integrated Circuit Device Including Through-silicon Via Structure Having Offset Interface
App 20130119547 - Kim; Su-kyoung ; et al. | 2013-05-16 |
Method Of Manufacturing A Semiconductor Device And Method Of Manufacturing A Semiconductor Package Including The Same
App 20120282736 - MOON; Kwang-Jin ; et al. | 2012-11-08 |
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