Lee; Date-Gun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Date-Gun.The latest application filed is for "method for forming an interconnection line in a semiconductor device".

Company Profile

0.6.7

Lee; Date-Gun - Icheon KR
Lee; Date-Gun - Bucheon KR
Lee; Date-Gun - Icheon-city KR
Lee, Date Gun - Icheon-si KR
Lee, Date-Gun - Bucheon-city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for forming an interconnection line in a semiconductor device Grant 7,307,015 - Lee December 11, 2	2007-12-11
Method for forming metal pattern to reduce contact resistivity with interconnection contact Grant 7,271,091 - Lee September 18, 2	2007-09-18
Methods for preventing copper oxidation in a dual damascene process Grant 7,186,644 - Lee March 6, 2	2007-03-06
Methods for fabricating a semiconductor device with etch end point detection Grant 7,183,218 - Lee February 27, 2	2007-02-27
Bonding pad of a semiconductor device and formation method thereof Grant 6,995,082 - Lee February 7, 2	2006-02-07
Method for forming an interconnection line in a semiconductor device App 20060014382 - Lee; Date-Gun	2006-01-19
Methods to fabricate semiconductor devices Grant 6,972,242 - Lee December 6, 2	2005-12-06
Method for forming a contact in semiconductor device App 20050142886 - Lee, Kang Hyun ; et al.	2005-06-30
Methods for preventing copper oxidation in a dual damascene process App 20050142854 - Lee, Date Gun	2005-06-30
Method for forming metal pattern to reduce contact resistivity with interconnection contact App 20050142841 - Lee, Date-Gun	2005-06-30
Methods to fabricate semiconductor devices App 20040132307 - Lee, Date-Gun	2004-07-08
Methods to fabricate a semiconductor device App 20040127055 - Lee, Date-Gun	2004-07-01
Bonding pad of a semiconductor device and formation method thereof App 20040115942 - Lee, Date-Gun	2004-06-17

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