LEE; Dae Jun
Patent Applications and Registrations
Patent applications and USPTO patent grants for LEE; Dae Jun.The latest application filed is for "apparatus for processing a wafer and method of depositing a thin film using the same".
- LEE; Dae Jun - Pyeongtaek-si Gyeonggi-do KR
- Lee; Dae-Jun - Pohang-city Gyungbuk 791-708 KR
| Patent | Date |
|---|---|
| Apparatus For Processing A Wafer And Method Of Depositing A Thin Film Using The Same App 20170369994 - LEE; Dae Jun ; et al. | 2017-12-28 |
| Tubular structure and modular building assembly using the same Grant 7,155,874 - Lee January 2, 2 | 2007-01-02 |
| Tubular structure and modular building assembly using the same App 20040093825 - Lee, Dae-Jun | 2004-05-20 |
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