Lee; Cliff C.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Cliff C..The latest application filed is for "interface structures for packaged circuitry and method of providing same".
- Lee; Cliff C. - Portland OR
| Patent | Date |
|---|---|
| Microelectronic substrate for alternate package functionality Grant 9,961,769 - Hossain , et al. May 1, 2 | 2018-05-01 |
| Interface Structures For Packaged Circuitry And Method Of Providing Same App 20180005972 - HOSSAIN; Md Altaf ; et al. | 2018-01-04 |
| Microelectronic Substrate For Alternate Package Functionality App 20140133075 - Hossain; Md Altaf ; et al. | 2014-05-15 |
| Microelectronic substrate for alternate package functionality Grant 8,674,235 - Hossain , et al. March 18, 2 | 2014-03-18 |
| Microelectronic Substrate For Alternate Package Functionality App 20120305303 - Hossain; Md Altaf ; et al. | 2012-12-06 |
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