LEE; CHUNGSUN

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; CHUNGSUN.The latest application filed is for "semiconductor package including an image sensor chip and a method of fabricating the same".

Company Profile

2.17.27

LEE; CHUNGSUN - Asan-si KR
Lee; Chungsun - Anyang-si N/A KR
Lee; Chungsun - Gunpo-si KR
Lee; Chungsun - Anyang KR
Lee; Chungsun - Anyang-City KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package Including An Image Sensor Chip And A Method Of Fabricating The Same App 20220254827 - CHO; YONGHOE ; et al.	2022-08-11
Semiconductor Package And Method Of Manufacturing The Same App 20220157757 - Seok; Seyeong ; et al.	2022-05-19
Semiconductor package including an image sensor chip and a method of fabricating the same Grant 11,335,719 - Cho , et al. May 17, 2	2022-05-17
Interconnection Structure, Method Of Fabricating The Same, And Semiconductor Package Including Interconnection Structure App 20220068785 - HONG; JI-SEOK ; et al.	2022-03-03
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20220059466 - SONG; Solji ; et al.	2022-02-24
Interconnection Structure And Semiconductor Package Including The Same App 20220059442 - OH; Dongjoon ; et al.	2022-02-24
Semiconductor Packages App 20220037248 - CHOI; Ju-Il ; et al.	2022-02-03
Semiconductor Package And Method Of Fabricating The Same App 20220037255 - Hwang; Hyunsu ; et al.	2022-02-03
Semiconductor Device And Semiconductor Package Including The Same App 20210384137 - CHOI; Ju-IL ; et al.	2021-12-09
Interconnection Structure And Semiconductor Package Including The Same App 20210343634 - CHOI; Ju-Il ; et al.	2021-11-04
Wafer Trimming Device App 20210320000 - AHN; Jungseok ; et al.	2021-10-14
Semiconductor Package Including An Image Sensor Chip And A Method Of Fabricating The Same App 20210028217 - CHO; YONGHOE ; et al.	2021-01-28
Method of fabricating a semiconductor device Grant 10,157,766 - Kang , et al. Dec	2018-12-18
Methods of processing substrates Grant 9,595,446 - Lee , et al. March 14, 2	2017-03-14
Method Of Fabricating A Semiconductor Device App 20170004990 - Kang; Un-Byoung ; et al.	2017-01-05
Methods for processing substrates Grant 9,412,636 - Lee , et al. August 9, 2	2016-08-09
Methods For Processing Substrates App 20150214089 - LEE; CHUNGSUN ; et al.	2015-07-30
Semiconductor packages and methods of fabricating the same Grant 9,059,072 - Choi , et al. June 16, 2	2015-06-16
Methods for processing substrates Grant 9,023,716 - Lee , et al. May 5, 2	2015-05-05
Methods of processing substrates Grant 9,006,081 - Ahn , et al. April 14, 2	2015-04-14
Semiconductor device for semiconductor package having through silicon vias of different heights Grant 8,933,561 - Jeong , et al. January 13, 2	2015-01-13
Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package Grant 8,928,132 - Choi , et al. January 6, 2	2015-01-06
Semiconductor Packages And Methods Of Fabricating The Same App 20140300004 - CHOI; Eun-Kyoung ; et al.	2014-10-09
Methods For Processing Substrates App 20140210075 - LEE; CHUNGSUN ; et al.	2014-07-31
Methods Of Processing Substrates App 20140213039 - LEE; Chungsun ; et al.	2014-07-31
Semiconductor packages and methods of fabricating the same Grant 8,759,147 - Choi , et al. June 24, 2	2014-06-24
Methods Of Processing Substrates App 20120329249 - Ahn; Jung-Seok ; et al.	2012-12-27
Semiconductor Package Having Through Silicon Via (tsv) Interposer And Method Of Manufacturing The Semiconductor Package App 20120211885 - Choi; YunSeok ; et al.	2012-08-23
Semiconductor Packages And Methods Of Fabricating The Same App 20120171814 - CHOI; Eun-Kyoung ; et al.	2012-07-05
Semiconductor Package And Method Of Manufacturing The Same App 20120139097 - JIN; JEONGGI ; et al.	2012-06-07
Semiconductor Package And Method Of Forming The Same App 20120119346 - IM; YUNHYEOK ; et al.	2012-05-17
Semiconductor Devices And Methods Of Fabricating The Same App 20120091580 - Jeong; SeYoung ; et al.	2012-04-19
Bump structure for a semiconductor device and method of manufacture Grant 8,105,934 - Kwon , et al. January 31, 2	2012-01-31
Bump structure for a semiconductor device and method of manufacture App 20090305494 - Kwon; Yonghwan ; et al.	2009-12-10
Bump structure for a semiconductor device and method of manufacture App 20050233569 - Kwon, Yonghwan ; et al.	2005-10-20

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