| Patent | Date |
|---|
Method for manufacturing semiconductor package having redistribution layer
Grant 11,315,802 - Kim , et al. April 26, 2 | 2022-04-26 |
Light emitting diode display device
Grant 10,957,833 - Sakong , et al. March 23, 2 | 2021-03-23 |
Method For Manufacturing Semiconductor Package Having Redistribution Layer
App 20200066545 - KIM; Il Hwan ; et al. | 2020-02-27 |
Light Emitting Diode Display Device
App 20190305202 - SAKONG; Tan ; et al. | 2019-10-03 |
Semiconductor chip stack having improved encapsulation
Grant 9,343,432 - Lee , et al. May 17, 2 | 2016-05-17 |
Semiconductor Package And Method Of Fabricating The Same
App 20140252626 - KANG; Un-Byoung ; et al. | 2014-09-11 |
Stack package and semiconductor package including the same
Grant 8,791,562 - Lee , et al. July 29, 2 | 2014-07-29 |
Semiconductor Device And Method Of Fabricating The Same
App 20140091460 - LEE; Chung-Sun ; et al. | 2014-04-03 |
Semiconductor device including a stack of semiconductor chips, underfill material and molding material
Grant 8,604,615 - Lee , et al. December 10, 2 | 2013-12-10 |
Method for manufacturing tape wiring board
Grant 8,250,750 - Choi , et al. August 28, 2 | 2012-08-28 |
Semiconductor Device And Method Of Fabricating The Same
App 20120193779 - Lee; Chung-Sun ; et al. | 2012-08-02 |
Camera modules and methods of fabricating the same
Grant 8,114,701 - Kwon , et al. February 14, 2 | 2012-02-14 |
Stack Package And Semiconductor Package Including The Same
App 20120018871 - LEE; Chung-sun ; et al. | 2012-01-26 |
Method For Manufacturing Tape Wiring Board
App 20110119912 - Choi; Kyoung-Sei ; et al. | 2011-05-26 |
Camera module and electronic apparatus having the same
Grant 7,948,555 - Kwon , et al. May 24, 2 | 2011-05-24 |
Method for manufacturing tape wiring board
Grant 7,895,742 - Choi , et al. March 1, 2 | 2011-03-01 |
Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package
Grant 7,893,514 - Kwon , et al. February 22, 2 | 2011-02-22 |
Image sensor having through via
Grant 7,884,392 - Lee , et al. February 8, 2 | 2011-02-08 |
Method Of Manufacturing A Semiconductor Device Having An Even Coating Thickness Using Electro-less Plating And Related Device
App 20100320500 - KANG; UN BYOUNG ; et al. | 2010-12-23 |
Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device
Grant 7,786,581 - Kang , et al. August 31, 2 | 2010-08-31 |
Stack Type Semiconductor Chip Package Having Different Type Of Chips And Fabrication Method Thereof
App 20100019338 - KWON; Woon-Seong ; et al. | 2010-01-28 |
Stack type semiconductor chip package having different type of chips and fabrication method thereof
Grant 7,619,315 - Kwon , et al. November 17, 2 | 2009-11-17 |
Camera module, method of manufacturing the same, and electronic system having the same
App 20090256931 - Lee; Chung-Sun ; et al. | 2009-10-15 |
Image Sensor Having Through Via
App 20090200632 - LEE; Hyuek-Jae ; et al. | 2009-08-13 |
Wafer-level-chip-scale package and method of fabrication
Grant 7,569,423 - Kwon , et al. August 4, 2 | 2009-08-04 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same
Grant 7,554,201 - Kang , et al. June 30, 2 | 2009-06-30 |
Camera Modules And Methods Of Fabricating The Same
App 20090130791 - KWON; Woon-Seong ; et al. | 2009-05-21 |
Camera Module And Electronic Apparatus Having The Same
App 20090122178 - KWON; Yong-Hwan ; et al. | 2009-05-14 |
Semiconductor Package With Through Silicon Via And Related Method Of Fabrication
App 20080284041 - JANG; Hyung-sun ; et al. | 2008-11-20 |
Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device
App 20080258299 - Kang; Un Byoung ; et al. | 2008-10-23 |
Image Sensor Package, Method Of Manufacturing The Same, And Image Sensor Module Including The Image Sensor Package
App 20080251872 - KWON; Woon-Seong ; et al. | 2008-10-16 |
Wafer-level-chip-scale Package And Method Of Fabrication
App 20080242000 - KWON; Yong-hwan ; et al. | 2008-10-02 |
Stack Type Semiconductor Chip Package Having Different Type Of Chips And Fabrication Method Thereof
App 20080169546 - KWON; Woon-Seong ; et al. | 2008-07-17 |
Bump Electrode Including Plating Layers And Method Of Fabricating The Same
App 20080083983 - JANG; Hyang-sun ; et al. | 2008-04-10 |
Semiconductor Package Including Silver Bump And Method For Fabricating The Same
App 20080054456 - KANG; Un-byoung ; et al. | 2008-03-06 |
Image Sensor Package, Related Method Of Manufacture And Image Sensor Module
App 20080055438 - Lee; Chung-sun ; et al. | 2008-03-06 |
Method For Manufacturing Tape Wiring Board
App 20080029923 - CHOI; Kyoung-Sei ; et al. | 2008-02-07 |
Image sensor package and method of fabricating the same
App 20080012084 - Kwon; Yong-Hwan ; et al. | 2008-01-17 |
Method for manufacturing tape wiring board
Grant 7,299,547 - Choi , et al. November 27, 2 | 2007-11-27 |
Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same
App 20070152331 - Kang; Uu-Byung ; et al. | 2007-07-05 |
Circuit Film With Bump, Film Package Using The Same, And Related Fabrication Methods
App 20070126110 - KWON; Yong-Hwan ; et al. | 2007-06-07 |
Circuit film with bump, film package using the same, and related fabrication methods
Grant 7,190,073 - Kwon , et al. March 13, 2 | 2007-03-13 |
Wafer-level-chip-scale package and method of fabrication
App 20070018324 - Kwon; Yong-hwan ; et al. | 2007-01-25 |
Semiconductor Package With Molded Back Side And Method Of Fabricating The Same
App 20070007664 - LEE; Chung-Sun ; et al. | 2007-01-11 |
Method Of Forming Redistribution Bump And Semiconductor Chip And Mount Structure Fabricated Using The Same
App 20060202334 - KWON; Yong-Hwan ; et al. | 2006-09-14 |
Tape circuit substrate and semiconductor chip package using the same
Grant 7,087,987 - Chung , et al. August 8, 2 | 2006-08-08 |
Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same
Grant 7,078,331 - Kwon , et al. July 18, 2 | 2006-07-18 |
Film circuit substrate having Sn-In alloy layer
App 20060091504 - Kang; Un-Byoung ; et al. | 2006-05-04 |
Film substrate of a semiconductor package and a manufacturing method
App 20060071303 - Lee; Chung-Sun ; et al. | 2006-04-06 |
Method for manufacturing tape wiring board
App 20060003568 - Choi; Kyoung-Sei ; et al. | 2006-01-05 |
Circuit film with bump, film package using the same, and related fabrication methods
App 20050285277 - Kwon, Yong-Hwan ; et al. | 2005-12-29 |
Method of manufacturing tape wiring substrate
App 20050205524 - Lee, Chung-Sun ; et al. | 2005-09-22 |
Tape circuit substrate and semiconductor chip package using the same
App 20050046033 - Chung, Ye-Chung ; et al. | 2005-03-03 |
Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same
App 20050017343 - Kwon, Yong-Hwan ; et al. | 2005-01-27 |
Package and method for bonding between gold lead and gold bump
App 20040251546 - Lee, Si-Hoon ; et al. | 2004-12-16 |
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