Lee; Chun-Yang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Chun-Yang.The latest application filed is for "semiconductor package for controlling warpage".
- Lee; Chun-Yang - Kaohsiung N/A TW
- Lee; Chun-Yang - Kaohsiung City TW
- Lee; Chun-yang - Taoyuan Hsien Taiwan CN
| Patent | Date |
|---|---|
| Semiconductor package for controlling warpage Grant 8,629,541 - Ou , et al. January 14, 2 | 2014-01-14 |
| Semiconductor Package For Controlling Warpage App 20120056336 - Ou; Min-Shin ; et al. | 2012-03-08 |
| Ball grid array package App 20070194436 - Kao; Chung-Yao ; et al. | 2007-08-23 |
| Bookmark Grant 7,055,861 - Lee June 6, 2 | 2006-06-06 |
| Flip-chip Substrate And Flip-chip Bonding Process Thereof App 20050282311 - Chen, Yu-Wen ; et al. | 2005-12-22 |
| [flip-chip Substrate And Flip-chip Bonding Process Thereof] App 20040119171 - Chen, Yu-Wen ; et al. | 2004-06-24 |
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