Lee; Chun-Che

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Chun-Che.The latest application filed is for "semiconductor substrate and method for manufacturing the same".

Company Profile

2.20.18

Lee; Chun-Che - Kaohsiung TW
LEE; Chun-che - Kaohsiung City TW
Lee; Chun-Che - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor substrate and method for manufacturing the same Grant 11,398,421 - Lee , et al. July 26, 2	2022-07-26
Semiconductor Substrate And Method For Manufacturing The Same App 20190148280 - Lee; Chun-Che ; et al.	2019-05-16
Semiconductor substrate mitigating bridging Grant 10,181,438 - Lee , et al. Ja	2019-01-15
Semiconductor substrate and manufacturing method thereof Grant 10,049,976 - Chen , et al. August 14, 2	2018-08-14
Polymer of fluorine-containing sulfonated poly(arylene ether)s and method of manufacturing the same Grant 9,748,594 - Huang , et al. August 29, 2	2017-08-29
Polymer Of Fluorine-containing Sulfonated Poly(arylene Ether)s And Method Of Manufacturing The Same App 20170214075 - HUANG; Wen-yao ; et al.	2017-07-27
Polymer of fluorine-containing sulfonated poly(arylene ether)s and method of manufacturing the same Grant 9,644,069 - Huang , et al. May 9, 2	2017-05-09
Polymer Of Fluorine-containing Sulfonated Poly(arylene Ether)s And Method Of Manufacturing The Same App 20170009016 - HUANG; Wen-yao ; et al.	2017-01-12
Substrate for semiconductor package and process for manufacturing Grant 9,437,532 - Chen , et al. September 6, 2	2016-09-06
Semiconductor Substrate And Manufacturing Method Thereof App 20160225708 - CHEN; Tien-Szu ; et al.	2016-08-04
Embedded component device and manufacturing methods thereof Grant 9,406,658 - Lee , et al. August 2, 2	2016-08-02
Substrate For Semiconductor Package And Process For Manufacturing App 20160104667 - Chen; Tien-Szu ; et al.	2016-04-14
Substrate for semiconductor package and process for manufacturing Grant 9,224,707 - Chen , et al. December 29, 2	2015-12-29
Polymer of sulfonated poly(arylene ether)s and manufacturing method thereof Grant 9,209,472 - Huang , et al. December 8, 2	2015-12-08
Semiconductor substrate and method for making the same Grant 9,117,697 - Lee , et al. August 25, 2	2015-08-25
Polymer Of Sulfonated Poly(arylene Ether)s And Manufacturing Method Thereof App 20150200411 - HUANG; Wen-yao ; et al.	2015-07-16
Semiconductor Substrate And Method For Manufacturing The Same App 20150115469 - LEE; Chun-Che ; et al.	2015-04-30
Polymer of sulfonated poly(arlene ether)s and manufacturing method thereof Grant 9,018,336 - Huang , et al. April 28, 2	2015-04-28
Fuel cell catalyst layer having sulfonated poly(arylene ether)s and manufacturing method thereof Grant 8,987,407 - Huang , et al. March 24, 2	2015-03-24
Polymer Of Sulfonated Poly(arylene Ether)s And Manufacturing Method Thereof App 20150031849 - Huang; Wen-yao ; et al.	2015-01-29
Fuel Cell Catalyst Layer Having Sulfonated Poly(arylene Ether)s And Manufacturing Method Thereof App 20150030965 - HUANG; Wen-yao ; et al.	2015-01-29
Substrate For Semiconductor Package And Process For Manufacturing App 20150021766 - Chen; Tien-Szu ; et al.	2015-01-22
Semiconductor Substrate And Method For Making The Same App 20140367837 - LEE; Chun-Che ; et al.	2014-12-18
Substrate for semiconductor package and process for manufacturing Grant 8,884,443 - Chen , et al. November 11, 2	2014-11-11
Process of fabricating a circuit board Grant 8,720,053 - Lee , et al. May 13, 2	2014-05-13
Substrate For Semiconductor Package And Process For Manufacturing App 20140008814 - Chen; Tien-Szu ; et al.	2014-01-09
Leadframe package structure and manufacturing method thereof Grant 8,309,400 - Appelt , et al. November 13, 2	2012-11-13
Embedded Component Device And Manufacturing Methods Thereof App 20120153493 - LEE; CHUN-CHE ; et al.	2012-06-21
Leadframe Package Structure And Manufacturing Method Thereof App 20120091569 - Appelt; Bernd Karl ; et al.	2012-04-19
LED bulb structure having insertion end, and/or heat dissipation element, and/or heat-and-electricity separated element Grant 8,143,770 - Chan , et al. March 27, 2	2012-03-27
LED structure Grant 7,910,395 - Shei , et al. March 22, 2	2011-03-22
Circuit Board And Process Of Fabricating The Same App 20100071937 - Lee; Shih-Chang ; et al.	2010-03-25
LED Structure App 20100059733 - Shei; Shih-Chang ; et al.	2010-03-11
Led Bulb Structure Having Insertion End, And/or Heat Dissipation Element, And/or Heat-and-electricity Separated Element App 20100060131 - Chan; Cheng-Wei ; et al.	2010-03-11
Reinforced Flexible Substrates And Method Therefor App 20010048999 - KUN-CHING, CHEN ; et al.	2001-12-06
Semiconductor packaging device Grant 5,982,625 - Chen , et al. November 9, 1	1999-11-09

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