loadpatents
name:-0.011395931243896
name:-0.012369155883789
name:-0.0017530918121338
Lee; Chun Patent Filings

Lee; Chun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Chun.The latest application filed is for "phase and frequency digital synchronizer".

Company Profile
1.13.10
  • Lee; Chun - Portland OR
  • Lee; Chun - Cincinnati OH
  • Lee; Chun - Ann Arbor MI
  • Lee; Chun - Cupertino CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Phase and frequency digital synchronizer
Grant 10,374,614 - Schrom , et al.
2019-08-06
Phase And Frequency Digital Synchronizer
App 20190199358 - Schrom; Gerhard ;   et al.
2019-06-27
Polyolefin-based compositions, adhesives, and related multi-layered structures prepared therefrom
Grant 9,803,074 - Botros , et al. October 31, 2
2017-10-31
Controlled rheology formulations containing high melt strength polypropylene for extrusion coating
Grant 9,150,717 - Lee , et al. October 6, 2
2015-10-06
Polyolefin-based Compositions, Adhesives, And Related Multi-layered Structures Prepared Therefrom
App 20150267087 - Botros; Maged G. ;   et al.
2015-09-24
Controlled Rheology Formulations Containing High Melt Strength Polypropylene For Extrusion Coating
App 20140031462 - Lee; Chun ;   et al.
2014-01-30
Controlled rheology formulations containing high melt strength polypropylene for extrusion coating
Grant 8,575,252 - Lee , et al. November 5, 2
2013-11-05
Calibration Circuit Apparatus And Method
App 20130257523 - Lu; Cho-Ying ;   et al.
2013-10-03
Extrusion processes using high melt strength polypropylene
Grant 8,546,504 - Lee , et al. October 1, 2
2013-10-01
Calibration circuit apparatus and method
Grant 8,536,899 - Lu , et al. September 17, 2
2013-09-17
Co-continuous heterophase polymer compositions containing high melt strength polypropylene for extrusion coating
Grant 8,389,632 - Lee , et al. March 5, 2
2013-03-05
Controlled Rheology Formulations Containing High Melt Strength Polypropylene For Extrusion Coating
App 20120199278 - LEE; Chun ;   et al.
2012-08-09
Co-continuous Heterophase Polymer Compositions Containing High Melt Strength Polypropylene For Extrusion Coating
App 20120202933 - LEE; Chun ;   et al.
2012-08-09
Extrusion Processes Using High Melt Strength Polypropylene
App 20120199279 - LEE; Chun ;   et al.
2012-08-09
Process For Forming Multilayer Structures Containing A Metal Layer
App 20120196138 - BOTROS; Maged G. ;   et al.
2012-08-02
Feedback circuits with DC offset cancellation
Grant 8,169,351 - Lee May 1, 2
2012-05-01
Feedback Circuits With Dc Offset Cancellation
App 20110095924 - Lee; Chun
2011-04-28
Beam conditioning to reduce spatial coherence
Grant 7,926,959 - Kvamme , et al. April 19, 2
2011-04-19

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