Lee; Chu-Chung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Chu-Chung.The latest application filed is for "coated bonding wire and methods for bonding using same".

Company Profile

2.40.43

Lee; Chu-Chung - Round Rock TX US
Lee; Chu-Chung - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Surface finish for wirebonding Grant 10,325,876 - Mathew , et al.	2019-06-18
Copper ball bond features and structure Grant 9,461,012 - Higgins, III , et al. October 4, 2	2016-10-04
Electronic component package and method for forming same Grant 9,437,574 - Tran , et al. September 6, 2	2016-09-06
Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure Grant 9,437,459 - Carpenter , et al. September 6, 2	2016-09-06
Coated bonding wire and methods for bonding using same Grant 9,368,470 - Lee , et al. June 14, 2	2016-06-14
Coated Bonding Wire And Methods For Bonding Using Same App 20160126208 - LEE; CHU-CHUNG ; et al.	2016-05-05
Localized alloying for improved bond reliability Grant 9,331,050 - Hess , et al. May 3, 2	2016-05-03
Integrated circuit package with voltage distributor Grant 9,331,046 - Lee , et al. May 3, 2	2016-05-03
Structures for reducing corrosion in wire bonds Grant 9,324,675 - Carpenter , et al. April 26, 2	2016-04-26
Copper ball bond interface structure and formation Grant 9,257,403 - Tran , et al. February 9, 2	2016-02-09
Surface Finish For Wirebonding App 20150380376 - MATHEW; VARUGHESE ; et al.	2015-12-31
Aluminum Clad Copper Structure Of An Electronic Component Package App 20150318240 - CARPENTER; BURTON J. ; et al.	2015-11-05
Structures And Methods For Reducing Corrosion In Wire Bonds App 20150311173 - CARPENTER; BURTON J. ; et al.	2015-10-29
Systems And Methods For Multiple Ball Bond Structures App 20150303169 - Tran; Tu-Anh N. ; et al.	2015-10-22
Encapsulant for a semiconductor device Grant 9,093,383 - Chopin , et al. July 28, 2	2015-07-28
Copper Ball Bond Interface Structure and Formation App 20150145148 - Tran; Tu-Anh N. ; et al.	2015-05-28
Electronic Component Package And Method For Forming Same App 20150090480 - TRAN; TU-ANH N. ; et al.	2015-04-02
Copper Ball Bond Features and Structure App 20150084199 - Higgins, III; Leo M. ; et al.	2015-03-26
Packaged integrated circuit using wire bonds Grant 8,912,667 - Wenzel , et al. December 16, 2	2014-12-16
Copper ball bond features and structure Grant 8,907,485 - Higgins, III , et al. December 9, 2	2014-12-09
Integrated Circuit Package With Voltage Distributor App 20140308779 - LEE; Chu-Chung ; et al.	2014-10-16
Encapsulant for a semiconductor device Grant 8,853,867 - Chopin , et al. October 7, 2	2014-10-07
Integrated circuit package with voltage distributor Grant 8,791,582 - Lee , et al. July 29, 2	2014-07-29
Encapsulant For A Semiconductor Device App 20140145339 - CHOPIN; Sheila F. ; et al.	2014-05-29
Semiconductor Device Structures And Methods For Copper Bond Pads App 20140061910 - LEE; CHU-CHUNG ; et al.	2014-03-06
Copper Ball Bond Features and Structure App 20140054781 - Higgins, III; Leo M. ; et al.	2014-02-27
Packaged Integrated Circuit Using Wire Bonds App 20130193589 - WENZEL; ROBERT J. ; et al.	2013-08-01
Molded semiconductor package having a filler material Grant 8,318,549 - Hess , et al. November 27, 2	2012-11-27
Localized Alloying For Improved Bond Reliability App 20120153464 - Hess; Kevin J. ; et al.	2012-06-21
Power lead-on-chip ball grid array package Grant 8,129,226 - Johnston , et al. March 6, 2	2012-03-06
Integrated Circuit Package With Voltage Distributor App 20120025401 - LEE; CHU-CHUNG ; et al.	2012-02-02
Localized alloying for improved bond reliability Grant 8,105,933 - Hess , et al. January 31, 2	2012-01-31
Molded Semiconductor Package Having A Filler Material App 20110101517 - Hess; Kevin J. ; et al.	2011-05-05
Interconnect for chip level power distribution Grant 7,829,997 - Hess , et al. November 9, 2	2010-11-09
Power Lead-on-Chip Ball Grid Array Package App 20100270663 - Johnston; James P. ; et al.	2010-10-28
Package device having crack arrest feature and method of forming Grant 7,821,104 - Lee , et al. October 26, 2	2010-10-26
Packaged integrated circuit Grant 7,750,465 - Hess , et al. July 6, 2	2010-07-06
Package Device Having Crack Arrest Feature And Method Of Forming App 20100052106 - LEE; Chu-Chung ; et al.	2010-03-04
Cap layer for an aluminum copper bond pad Grant 7,656,045 - Lee , et al. February 2, 2	2010-02-02
Method of packaging semiconductor devices Grant 7,632,715 - Hess , et al. December 15, 2	2009-12-15
Packaged integrated circuit with enhanced thermal dissipation Grant 7,572,680 - Hess , et al. August 11, 2	2009-08-11
Interconnect for improved die to substrate electrical coupling Grant 7,550,318 - Hess , et al. June 23, 2	2009-06-23
Novel interconnect for chip level power distribution App 20080246165 - Hess; Kevin J. ; et al.	2008-10-09
Packaged Integrated Circuit App 20080203588 - Hess; Kevin J. ; et al.	2008-08-28
Localized Alloying For Improved Bond Reliability App 20080179745 - Hess; Kevin J. ; et al.	2008-07-31
Method Of Packaging Semiconductor Devices App 20080164593 - Hess; Kevin J. ; et al.	2008-07-10
Packaged Integrated Circuit With Enhanced Thermal Dissipation App 20080136016 - Hess; Kevin J. ; et al.	2008-06-12
Semiconductor die edge reconditioning Grant 7,374,971 - Yuan , et al. May 20, 2	2008-05-20
Packaged integrated circuit with enhanced thermal dissipation Grant 7,355,289 - Hess , et al. April 8, 2	2008-04-08
Interconnect for improved die to substrate electrical coupling App 20080038912 - Hess; Kevin J. ; et al.	2008-02-14
Cap layer for an aluminum copper bond pad App 20070194460 - Lee; Chu-Chung ; et al.	2007-08-23
Semiconductor package with crossing conductor assembly and method of manufacture Grant 7,256,488 - Zhou , et al. August 14, 2	2007-08-14
Semiconductor die having a protective periphery region and method for forming App 20070087067 - Yuan; Yuan ; et al.	2007-04-19
Packaged integrated circuit with enhanced thermal dissipation App 20070023880 - Hess; Kevin J. ; et al.	2007-02-01
Semiconductor die edge reconditioning App 20060237850 - Yuan; Yuan ; et al.	2006-10-26
Semiconductor package with crossing conductor assembly and method of manufacture App 20060163716 - Zhou; Yaping ; et al.	2006-07-27
Semiconductor package with crossing conductor assembly and method of manufacture Grant 7,049,694 - Zhou , et al. May 23, 2	2006-05-23
Semiconductor package with crossing conductor assembly and method of manufacture App 20060065966 - Zhou; Yaping ; et al.	2006-03-30
Semiconductor package with crossing conductor assembly and method of manufacture Grant 6,992,377 - Zhou , et al. January 31, 2	2006-01-31
Semiconductor package with crossing conductor assembly and method of manufacture App 20050189643 - Zhou, Yaping ; et al.	2005-09-01
Integrated circuit with test pad structure and method of testing Grant 6,937,047 - Tran , et al. August 30, 2	2005-08-30
Integrated circuit die having a copper contact and method therefor Grant 6,933,614 - Lee , et al. August 23, 2	2005-08-23
Integrated circuit with test pad structure and method of testing App 20050030055 - Tran, Tu-Anh ; et al.	2005-02-10
Integrated circuit die having a copper contact and method therefor App 20040195696 - Lee, Chu-Chung ; et al.	2004-10-07
Ball grid array package having thermoelectric cooler Grant 6,196,002 - Newman , et al. March 6, 2	2001-03-06