Lee; Chu-An

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Chu-An.The latest application filed is for "fin isolation structure for finfet and method of forming the same".

Company Profile

13.10.12

Lee; Chu-An - Kaohsiung TW
LEE; Chu-An - Hsinchu TW
LEE; Chu-An - Hsinchu City TW
LEE; Chu-An - KAOHSIUNG CITY TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light-emitting device and method of forming the same Grant 11,282,988 - Lee , et al. March 22, 2	2022-03-22
Fin Isolation Structure For Finfet And Method Of Forming The Same App 20210265222 - LEE; Chu-An ; et al.	2021-08-26
Fin isolation structure for FinFET and method of forming the same Grant 10,998,239 - Lee , et al. May 4, 2	2021-05-04
Semiconductor Structure And Method Of Manufacturing The Same App 20210098283 - LEE; Shen-Nan ; et al.	2021-04-01
Wafer polishing with separated chemical reaction and mechanical polishing Grant 10,964,549 - Lee , et al. March 30, 2	2021-03-30
Light-emitting Device And Method Of Forming The Same App 20210036191 - LEE; Tsung-Xian ; et al.	2021-02-04
Ruthenium-containing semiconductor structure and method of manufacturing the same Grant 10,847,410 - Lee , et al. November 24, 2	2020-11-24
Fin Isolation Structure For Finfet And Method Of Forming The Same App 20200365588 - LEE; Chu-An ; et al.	2020-11-19
Post Cmp Cleaning Apparatus And Post Cmp Cleaning Methods App 20200294821 - WU; Chen-Hao ; et al.	2020-09-17
Slurry and manufacturing semiconductor using the slurry Grant 10,727,076 - Liao , et al.	2020-07-28
Fin isolation structure for FinFET and method of forming the same Grant 10,714,395 - Lee , et al.	2020-07-14
Wafer Polishing With Separated Chemical Reaction And Mechanical Polishing App 20200176264 - LEE; Shen-Nan ; et al.	2020-06-04
Slurry And Manufacturing Semiconductor Using The Slurry App 20200135486 - LIAO; CHUN-HUNG ; et al.	2020-04-30
Fin Isolation Structure For Finfet And Method Of Forming The Same App 20200091007 - LEE; Chu-An ; et al.	2020-03-19
Semiconductor Structure And Method Of Manufacturing The Same App 20200090983 - LEE; Shen-Nan ; et al.	2020-03-19
Adaptive endpoint method for pad life effect on chemical mechanical polishing Grant 9,333,619 - Lee , et al. May 10, 2	2016-05-10
Adapative Endpoint Method For Pad Life Effect On Chemical Mechanical Polishing App 20130146224 - Lee; Chu-An ; et al.	2013-06-13
Adaptive endpoint method for pad life effect on chemical mechanical polishing Grant 8,367,429 - Lee , et al. February 5, 2	2013-02-05
Adaptive Endpoint Method For Pad Life Effect On Chemical Mechanical Polishing App 20120231555 - Lee; Chu-An ; et al.	2012-09-13

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