Lee; Choon Kuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Choon Kuan.The latest application filed is for "novel build-up package for integrated circuit devices, and methods of making same".

Company Profile

5.85.69

Lee; Choon Kuan - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Build-up package for integrated circuit devices, and methods of making same Grant 11,367,667 - Ng , et al. June 21, 2	2022-06-21
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices Grant 11,239,128 - Ye , et al. February 1, 2	2022-02-01
Pre-encapsulated lead frames for microelectronic device packages, and associated methods Grant 11,189,548 - Wang , et al. November 30, 2	2021-11-30
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20200286801 - Ng; Hong Wan ; et al.	2020-09-10
Build-up package for integrated circuit devices, and methods of making same Grant 10,593,607 - Ng , et al.	2020-03-17
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20190371693 - Ye; Seng Kim Dalson ; et al.	2019-12-05
Electronic device assemblies including conductive vias having two or more conductive elements Grant 10,448,509 - Corisis , et al. Oc	2019-10-15
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices Grant 10,431,513 - Ye , et al. O	2019-10-01
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 10,211,114 - Corisis , et al. Feb	2019-02-19
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 10,008,468 - Lee , et al. June 26, 2	2018-06-26
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices App 20180005909 - Corisis; David J. ; et al.	2018-01-04
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20170301598 - Ye; Seng Kim Dalson ; et al.	2017-10-19
Pre-encapsulated Lead Frames For Microelectronic Device Packages, And Associated Methods App 20170288177 - Wang; Ai Chie ; et al.	2017-10-05
Carrierless Chip Package For Integrated Circuit Devices, And Methods Of Making Same App 20170271228 - Corisis; David J. ; et al.	2017-09-21
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 9,768,121 - Corisis , et al. September 19, 2	2017-09-19
Pre-encapsulated lead frames for microelectronic device packages, and associated methods Grant 9,721,874 - Wang , et al. August 1, 2	2017-08-01
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20170103961 - Lee; Choon Kuan ; et al.	2017-04-13
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 9,530,748 - Lee , et al. December 27, 2	2016-12-27
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices App 20160358831 - Corisis; David J. ; et al.	2016-12-08
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20160247737 - Ng; Hong Wan ; et al.	2016-08-25
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 9,362,141 - Corisis , et al. June 7, 2	2016-06-07
Stacked packaged integrated circuit devices, and methods of making same Grant 9,362,260 - Corisis , et al. June 7, 2	2016-06-07
Build-up package for integrated circuit devices, and methods of making same Grant 9,355,994 - Ng , et al. May 31, 2	2016-05-31
Electronic Device Assemblies Including Conductive Vias Having Two Or More Conductive Elements App 20150319860 - Corisis; David J. ; et al.	2015-11-05
Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices Grant 9,147,623 - Lua , et al. September 29, 2	2015-09-29
Methods of making an interposer structure with embedded capacitor structure Grant 9,142,427 - Chong , et al. September 22, 2	2015-09-22
Electronic device assemblies including conductive vias having two or more conductive elements Grant 9,084,360 - Corisis , et al. July 14, 2	2015-07-14
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same App 20150171061 - Corisis; David J. ; et al.	2015-06-18
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20150137364 - Ye; Seng Kim Dalson ; et al.	2015-05-21
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20150130081 - Lee; Choon Kuan ; et al.	2015-05-14
Packaged microelectronic devices recessed in support member cavities, and associated methods Grant 8,975,745 - Corisis , et al. March 10, 2	2015-03-10
Stacked packaged integrated circuit devices, and methods of making same Grant 8,963,302 - Corisis , et al. February 24, 2	2015-02-24
Microelectronic Packages With Leadframes, Including Leadframes Configured For Stacked Die Packages, And Associated Systems And Methods App 20150041204 - Chong; Chin Hui ; et al.	2015-02-12
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 8,940,581 - Lee , et al. January 27, 2	2015-01-27
Methods of manufacturing semiconductor device assemblies including face-to-face semiconductor dice Grant 8,927,332 - Tan , et al. January 6, 2	2015-01-06
Stacked Microelectronic Devices And Methods For Manufacturing Stacked Microelectronic Devices App 20140346683 - Lua; Edmund Koon Tian ; et al.	2014-11-27
Methods for making microelectronic die systems Grant 8,869,387 - Chong , et al. October 28, 2	2014-10-28
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20140295622 - Ng; Hong Wan ; et al.	2014-10-02
Stacked microelectronic devices Grant 8,823,159 - Ye , et al. September 2, 2	2014-09-02
Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices Grant 8,803,307 - Lua , et al. August 12, 2	2014-08-12
Land grid array semiconductor device packages Grant 8,796,836 - Lee , et al. August 5, 2	2014-08-05
Methods for packaging microelectronic devices and microelectronic devices formed using such methods Grant 8,772,947 - Lee , et al. July 8, 2	2014-07-08
Build-up package for integrated circuit devices, and methods of making same Grant 8,754,537 - Ng , et al. June 17, 2	2014-06-17
Methods Of Making An Interposer Structure With Embedded Capacitor Structure App 20140162412 - Chong; Chin Hui ; et al.	2014-06-12
Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements Grant 8,749,050 - Lee , et al. June 10, 2	2014-06-10
Interposer structure with embedded capacitor structure, and methods of making same Grant 8,653,625 - Hui , et al. February 18, 2	2014-02-18
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20130292853 - Ye; Seng Kim Dalson ; et al.	2013-11-07
Stacked Microelectronic Devices And Methods For Manufacturing Stacked Microelectronic Devices App 20130292854 - Lua; Edmund Koon Tian ; et al.	2013-11-07
Redistribution Elements And Semiconductor Device Packages Including Semiconductor Devices And Redistribution Elements App 20130292810 - Lee; Choon Kuan ; et al.	2013-11-07
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same App 20130256853 - Corisis; David J. ; et al.	2013-10-03
Packaged Microelectronic Devices Recessed In Support Member Cavities, And Associated Methods App 20130249092 - Corisis; David J. ; et al.	2013-09-26
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices App 20130252354 - Corisis; David J. ; et al.	2013-09-26
Electronic Device Assemblies Including Conductive Vias Having Two Or More Conductive Elements App 20130235517 - Corisis; David J. ; et al.	2013-09-12
Method for manufacturing microelectronic devices Grant 8,507,318 - Ye , et al. August 13, 2	2013-08-13
Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices Grant 8,501,546 - Lua , et al. August 6, 2	2013-08-06
Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices Grant 8,486,825 - Lee , et al. July 16, 2	2013-07-16
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 8,450,839 - Corisis , et al. May 28, 2	2013-05-28
Pre-encapsulated Lead Frames For Microelectronic Device Packages, And Associated Methods App 20130127027 - Wang; Ai Chie ; et al.	2013-05-23
Stacked packaged integrated circuit devices Grant 8,445,997 - Corisis , et al. May 21, 2	2013-05-21
Packaged microelectronic devices recessed in support member cavities, and associated methods Grant 8,441,132 - Corisis , et al. May 14, 2	2013-05-14
Methods Of Manufacturing Semiconductor Device Assemblies Including Face-to-face Semiconductor Dice App 20130115734 - Tan; Swee Seng Eric ; et al.	2013-05-09
Electronic device assemblies including conductive vias having two or more conductive elements Grant 8,426,743 - Corisis , et al. April 23, 2	2013-04-23
Pre-encapsulated lead frames for microelectronic device packages, and associated methods Grant 8,357,566 - Wang , et al. January 22, 2	2013-01-22
Method of manufacturing an interposer Grant 8,322,031 - Chong , et al. December 4, 2	2012-12-04
Semiconductor device packages including a semiconductor device and a redistribution element Grant 8,288,859 - Lee , et al. October 16, 2	2012-10-16
Methods For Packaging Microelectronic Devices And Microelectronic Devices Formed Using Such Methods App 20120248626 - Lee; Choon Kuan ; et al.	2012-10-04
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20120187567 - Lee; Choon Kuan ; et al.	2012-07-26
Methods for packaging microelectronic devices and microelectronic devices formed using such methods Grant 8,203,213 - Lee , et al. June 19, 2	2012-06-19
Packaged microelectronic devices recessed in support member cavities, and associated methods Grant 8,202,754 - Corisis , et al. June 19, 2	2012-06-19
Packaged Microelectronic Devices Recessed In Support Member Cavities, And Associated Methods App 20120146239 - Corisis; David J. ; et al.	2012-06-14
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same App 20120127685 - Corisis; David J. ; et al.	2012-05-24
Packaged microelectronic devices and associated systems Grant 8,148,807 - Lee , et al. April 3, 2	2012-04-03
Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components Grant 8,138,021 - Corisis , et al. March 20, 2	2012-03-20
Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates Grant 8,115,112 - Corisis , et al. February 14, 2	2012-02-14
Methods of forming stacked semiconductor devices with a leadframe and associated assemblies Grant 8,106,491 - Corisis , et al. January 31, 2	2012-01-31
Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices Grant 8,093,702 - Lua , et al. January 10, 2	2012-01-10
Semiconductor Device Packages Including A Semiconductor Device And A Redistribution Element App 20110266696 - Lee; Choon Kuan ; et al.	2011-11-03
Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates Grant 8,030,751 - Lee , et al. October 4, 2	2011-10-04
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices Grant 7,915,726 - Chong , et al. March 29, 2	2011-03-29
Methods of making metal core foldover package structures Grant 7,915,077 - Corisis , et al. March 29, 2	2011-03-29
Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device Grant 7,888,185 - Corisis , et al. February 15, 2	2011-02-15
Packaged Ic Device Comprising An Embedded Flex Circuit, And Methods Of Making The Same App 20100320578 - Lee; Choon Kuan ; et al.	2010-12-23
Methods For Packaging Microelectronic Devices And Microelectronic Devices Formed Using Such Methods App 20100276814 - Lee; Choon Kuan ; et al.	2010-11-04
Apparatus For Packaging Semiconductor Devices, Packaged Semiconductor Components, Methods Of Manufacturing Apparatus For Packaging Semiconductor Devices, And Methods Of Manufacturing Semiconductor Components App 20100279466 - Corisis; David J. ; et al.	2010-11-04
Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same Grant 7,816,778 - Lee , et al. October 19, 2	2010-10-19
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20100244272 - Lee; Choon Kuan ; et al.	2010-09-30
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20100187668 - Ng; Hong Wan ; et al.	2010-07-29
Methods for packaging microelectronic devices and microelectronic devices formed using such methods Grant 7,759,221 - Lee , et al. July 20, 2	2010-07-20
Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components Grant 7,759,785 - Corisis , et al. July 20, 2	2010-07-20
Microelectronic Packages With Leadframes, Including Leadframes Configured For Stacked Die Packages, And Associated Systems And Methods App 20100173454 - Chong; Chin Hui ; et al.	2010-07-08
Stacked microelectronic devices and methods for manufacturing microelectronic devices Grant 7,749,808 - Corisis , et al. July 6, 2	2010-07-06
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 7,745,920 - Lee , et al. June 29, 2	2010-06-29
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices App 20100117212 - Corisis; David J. ; et al.	2010-05-13
Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods Grant 7,692,931 - Chong , et al. April 6, 2	2010-04-06
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 7,671,459 - Corisis , et al. March 2, 2	2010-03-02
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20090302484 - Lee; Choon Kuan ; et al.	2009-12-10
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20090239337 - Ye; Seng Kim Dalson ; et al.	2009-09-24
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices Grant 7,557,443 - Ye , et al. July 7, 2	2009-07-07
Stackable Integrated Circuit Package App 20090091009 - Corisis; David J. ; et al.	2009-04-09
Stacked microelectronic devices and methods for manufacturing microelectronic devices Grant 7,485,969 - Corisis , et al. February 3, 2	2009-02-03
Slanted Vias For Electrical Circuits On Circuit Boards And Other Substrates App 20090008144 - Chong; Chin Hui ; et al.	2009-01-08
Metal Core Foldover Package Structures App 20080316728 - Corisis; David J. ; et al.	2008-12-25
Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package Grant 7,465,607 - Corisis , et al. December 16, 2	2008-12-16
Metal Core Foldover Package Structures App 20080299709 - Corisis; David J. ; et al.	2008-12-04
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same App 20080283977 - Corisis; David J. ; et al.	2008-11-20
Slanted vias for electrical circuits on circuit boards and other substrates Grant 7,435,913 - Chong , et al. October 14, 2	2008-10-14
Apparatus For Packaging Semiconductor Devices, Packaged Semiconductor Components, Methods Of Manufacturing Apparatus For Packaging Semiconductor Devices, And Methods Of Manufacturing Semiconductor Components App 20080224298 - Corisis; David J. ; et al.	2008-09-18
Interposer Structure With Embedded Capacitor Structure, And Methods Of Making Same App 20080224292 - Hui; Chong Chin ; et al.	2008-09-18
Metal core foldover package structures Grant 7,425,758 - Corisis , et al. September 16, 2	2008-09-16
Packaged Ic Device Comprising An Embedded Flex Circuit, And Methods Of Making Same App 20080197460 - Lee; Choon Kuan ; et al.	2008-08-21
Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device and methods for forming the same App 20080122113 - Corisis; David J. ; et al.	2008-05-29
Methods for designing carrier substrates with raised terminals Grant 7,368,391 - Tan , et al. May 6, 2	2008-05-06
Interconnecting Substrates For Microelectronic Dies, Methods For Forming Vias In Such Substrates, And Methods For Packaging Microelectronic Devices App 20080099931 - Chong; Chin Hui ; et al.	2008-05-01
Pre-encapsulated lead frames for microelectronic device packages, and associated methods App 20080048301 - Wang; Ai-Chie ; et al.	2008-02-28
Metal core foldover package structures, systems including same and methods of fabrication App 20080048309 - Corisis; David J. ; et al.	2008-02-28
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices Grant 7,326,591 - Chong , et al. February 5, 2	2008-02-05
Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods App 20080012110 - Chong; Chin Hui ; et al.	2008-01-17
Packaged microelectronic devices recessed in support member cavities, and associated methods App 20070228577 - Corisis; David J. ; et al.	2007-10-04
Microelectronic device assemblies including assemblies with recurved leadframes, and associated methods App 20070210441 - Corisis; David J. ; et al.	2007-09-13
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices App 20070181989 - Corisis; David J. ; et al.	2007-08-09
Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package App 20070166880 - Corisis; David J. ; et al.	2007-07-19
Methods for packaging microelectronic devices and microelectronic devices formed using such methods App 20070155048 - Lee; Choon Kuan ; et al.	2007-07-05
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices App 20070045834 - Chong; Chin Hui ; et al.	2007-03-01
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices App 20070045796 - Ye; Seng Kim Dalson ; et al.	2007-03-01
Slanted vias for electrical circuits on circuit boards and other substrates App 20060240687 - Chong; Chin Hui ; et al.	2006-10-26
Slanted vias for electrical circuits on circuit boards and other substrates Grant 7,083,425 - Chong , et al. August 1, 2	2006-08-01
Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks Grant 7,061,124 - Tan , et al. June 13, 2	2006-06-13
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods Grant 7,018,871 - Tan , et al. March 28, 2	2006-03-28
Slanted vias for electrical circuits on circuit boards and other substrates App 20060046537 - Chong; Chin Hui ; et al.	2006-03-02
Methods for designing carrier substrates with raised terminals App 20050287702 - Victor Tan, Cher Khng ; et al.	2005-12-29
Microelectronic component assemblies having exposed contacts Grant 6,921,860 - Peterson , et al. July 26, 2	2005-07-26
Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks App 20050029676 - Tan, Cher Khng Victor ; et al.	2005-02-10
Microelectronic Component Assemblies Having Exposed Contacts App 20040188123 - Peterson, Darin L. ; et al.	2004-09-30
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks Grant 6,787,923 - Tan , et al. September 7, 2	2004-09-07
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods App 20040077109 - Tan, Cher Khng Victor ; et al.	2004-04-22
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods App 20030193092 - Tan, Cher Khng Victor ; et al.	2003-10-16