Lee; Chiu-Wen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Chiu-Wen.The latest application filed is for "semiconductor device package and method of manufacturing the same".

Company Profile

0.5.8

Lee; Chiu-Wen - Kaohsiung TW
Lee; Chiu-Wen - Tainan City TW
Lee; Chiu Wen - Linyuan Hsiang TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device package including thermal dissipation element and method of manufacturing the same Grant 11,127,650 - Chang Chien , et al. September 21, 2	2021-09-21
Semiconductor Device Package And Method Of Manufacturing The Same App 20210265273 - CHANG CHIEN; Chien Lin ; et al.	2021-08-26
Semiconductor Device Package Including Thermal Dissipation Element And Method Of Manufacturing The Same App 20210265231 - CHANG CHIEN; Chien Lin ; et al.	2021-08-26
Semiconductor device and method for manufacturing the same Grant 9,960,136 - Hsiao , et al. May 1, 2	2018-05-01
Semiconductor Package Structure And Method For Manufacturing The Same App 20180114762 - CHIU; Ying-Ta ; et al.	2018-04-26
Semiconductor package structure and method for manufacturing the same Grant 9,953,930 - Chiu , et al. April 24, 2	2018-04-24
Semiconductor Device And Method For Manufacturing The Same App 20160358875 - HSIAO; Yu-Hsiang ; et al.	2016-12-08
Semiconductor device and method for manufacturing the same Grant 9,443,813 - Hsiao , et al. September 13, 2	2016-09-13
Semiconductor Device And Method For Manufacturing The Same App 20160260677 - HSIAO; Yu-Hsiang ; et al.	2016-09-08
Substrate structure of integrated embedded passive components and method for fabricating the same App 20060283627 - Chen; Ying-Chou ; et al.	2006-12-21
Test assembly for integrated circuit package Grant 6,788,092 - Cheng , et al. September 7, 2	2004-09-07
Test assembly for integrated circuit package App 20040155241 - Cheng, Po Jen ; et al.	2004-08-12
Test assembly for integrated circuit package App 20030193344 - Cheng, Po Jen ; et al.	2003-10-16

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