Lee; Ching-Kuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Ching-Kuan.The latest application filed is for "integrated millimeter-wave chip package".
- Lee; Ching-Kuan - Hsinchu County TW
- Lee; Ching-Kuan - Yunlin County TW
- Lee, Ching-Kuan - Taipei TW
| Patent | Date |
|---|---|
| Integrated millimeter-wave chip package Grant 9,941,226 - Tsai , et al. April 10, 2 | 2018-04-10 |
| Integrated Millimeter-wave Chip Package App 20160172317 - Tsai; Cheng-Hua ; et al. | 2016-06-16 |
| Polymer dispersed liquid crystal emulsion and polymer dispersed liquid crystal composite film App 20070131902 - Lee; Ching-Kuan ; et al. | 2007-06-14 |
| Abrasion-resistant compact disc App 20030218967 - Hsu, Chia-Wen ; et al. | 2003-11-27 |
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