loadpatents
name:-0.022958993911743
name:-0.01283597946167
name:-0.00037813186645508
Lee; Chih-Peng Patent Filings

Lee; Chih-Peng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Chih-Peng.The latest application filed is for "sram device and manufacturing method thereof".

Company Profile
0.12.19
  • Lee; Chih-Peng - Yunlin County TW
  • Lee; Chih-Peng - New Taipei N/A TW
  • LEE; CHIH-PENG - Tu-Cheng TW
  • Lee; Chih-Peng - Gaungdong CN
  • Lee; Chih-Peng - Guangdong CN
  • Lee; Chih-Peng - Shenzhen CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
SRAM device and manufacturing method thereof
Grant 11,329,056 - Chang , et al. May 10, 2
2022-05-10
Sram Device And Manufacturing Method Thereof
App 20210327884 - Chang; Shou-Zen ;   et al.
2021-10-21
Heat disspating apparatus and electronic device
Grant 8,804,336 - Lee August 12, 2
2014-08-12
Heat Pipe With One Wick Structure Supporting Another Wick Structure In Position
App 20130248152 - HWANG; CHING-BAI ;   et al.
2013-09-26
Thermal Module
App 20130087311 - LEE; CHIH-PENG ;   et al.
2013-04-11
Heat Dissipation Module
App 20130070418 - LEE; CHIH-PENG ;   et al.
2013-03-21
Heat Dissipation Device With Fastener
App 20130056192 - LEE; CHIH-PENG
2013-03-07
Heat Disspating Apparatus And Electronic Device
App 20120293958 - LEE; CHIH-PENG
2012-11-22
Clip Device And Clip Device Assembly
App 20120275850 - LEE; CHIH-PENG
2012-11-01
Loop-type heat exchange device
Grant 7,775,262 - Liu , et al. August 17, 2
2010-08-17
Heat exchange module
Grant 7,743,818 - Liu , et al. June 29, 2
2010-06-29
Rotary total heat exchange apparatus
Grant 7,565,923 - Liu , et al. July 28, 2
2009-07-28
Device for spreading viscous thermal medium on heat dissipation device for electronic component
Grant 7,556,689 - Lee , et al. July 7, 2
2009-07-07
Loop-type heat exchange device
Grant 7,552,759 - Liu , et al. June 30, 2
2009-06-30
Liquid cooling system suitable for removing heat from electronic components
Grant 7,472,743 - Liu , et al. January 6, 2
2009-01-06
Cooling device for multiple heat-generating components
Grant 7,444,827 - Lee , et al. November 4, 2
2008-11-04
Refrigeration system
Grant 7,308,802 - Liu , et al. December 18, 2
2007-12-18
Heat Exchange Module
App 20070012427 - Liu; Tay-Jian ;   et al.
2007-01-18
Loop-type Heat Exchange Device
App 20060283577 - Liu; Tay-Jian ;   et al.
2006-12-21
Loop-type Heat Exchange Device
App 20060272798 - Liu; Tay-Jian ;   et al.
2006-12-07
Liquid Cooling System Suitable For Removing Heat From Electronic Components
App 20060266498 - Liu; Tay-Jian ;   et al.
2006-11-30
Device For Spreading Viscous Thermal Medium On Heat Dissipation Device For Electronic Component
App 20060260541 - Lee; Chih-Peng ;   et al.
2006-11-23
Liquid Cooling System Suitable For Removing Heat From Electronic Components
App 20060249278 - Liu; Tay-Jian ;   et al.
2006-11-09
Modular jack connector having anti-mismating element
Grant 7,131,872 - Lee , et al. November 7, 2
2006-11-07
Refrigeration system
App 20060218955 - Liu; Tay-Jian ;   et al.
2006-10-05
Cooling Device For Multiple Heat-generating Components
App 20060196207 - Lee; Chih-Peng ;   et al.
2006-09-07
Rotary total heat exchange apparatus
App 20060137852 - Liu; Tay-Jian ;   et al.
2006-06-29

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