loadpatents
Patent applications and USPTO patent grants for LEE; Chih-Fei.The latest application filed is for "semiconductor structure and fabricating method thereof".
Patent | Date |
---|---|
Semiconductor Structure And Fabricating Method Thereof App 20220310528 - LEE; Kuo-Hung ;   et al. | 2022-09-29 |
Semiconductor structure and fabricating method thereof Grant 11,362,039 - Lee , et al. June 14, 2 | 2022-06-14 |
Semiconductor Device With Nanostructures And Methods Of Forming The Same App 20210028318 - TSENG; Hsin-Hsiang ;   et al. | 2021-01-28 |
Semiconductor Structure And Fabricating Method Thereof App 20210028120 - LEE; Kuo-Hung ;   et al. | 2021-01-28 |
Semiconductor structure and fabricating method thereof Grant 10,804,211 - Lee , et al. October 13, 2 | 2020-10-13 |
Semiconductor device with nanostructures and methods of forming the same Grant 10,804,414 - Tseng , et al. October 13, 2 | 2020-10-13 |
Semiconductor Device And Methods Of Forming The Same App 20190252559 - Tseng; Hsin-Hsiang ;   et al. | 2019-08-15 |
Semiconductor device with nanostructures and methods of forming the same Grant 10,269,990 - Tseng , et al. | 2019-04-23 |
Method of forming redistribution layer Grant 10,134,694 - Lee , et al. November 20, 2 | 2018-11-20 |
Semiconductor Structure And Fabricating Method Thereof App 20180323152 - LEE; Kuo-Hung ;   et al. | 2018-11-08 |
Isolation structure for reducing crosstalk between pixels and fabrication method thereof Grant 10,115,758 - Chen , et al. October 30, 2 | 2018-10-30 |
Semiconductor structure and fabricating method thereof Grant 10,020,265 - Lee , et al. July 10, 2 | 2018-07-10 |
Semiconductor Device And Methods Of Forming The Same App 20180166592 - Tseng; Hsin-Hsiang ;   et al. | 2018-06-14 |
Isolation Structure For Reducing Crosstalk Between Pixels And Fabrication Method Thereof App 20180166476 - Chen; Kai-Yi ;   et al. | 2018-06-14 |
Semiconductor Structure And Fabricating Method Thereof App 20170179037 - LEE; Kuo-Hung ;   et al. | 2017-06-22 |
Under Bump Metallization App 20160268221 - Lee; Chih-Fei ;   et al. | 2016-09-15 |
Under bump metallization Grant 9,373,594 - Lee , et al. June 21, 2 | 2016-06-21 |
Under Bump Metallization App 20150228593 - Lee; Chih-Fei ;   et al. | 2015-08-13 |
Interactive Devices App 20090101072 - Lee; Chih-Fei | 2009-04-23 |
Plant Tissue Culture Display Box App 20090031628 - Lee; Chih-Fei | 2009-02-05 |
Firefly Container App 20090031958 - Lin; Shiue-Lian ;   et al. | 2009-02-05 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.