| Patent | Date |
|---|
Package substrate
Grant 11,432,406 - Hsu , et al. August 30, 2 | 2022-08-30 |
Semiconductor substrate and method for manufacturing the same
Grant 11,398,421 - Lee , et al. July 26, 2 | 2022-07-26 |
Package Substrate, Electronic Device Package And Method For Manufacturing The Same
App 20220157745 - HSU; Wu Chou ; et al. | 2022-05-19 |
Package substrate, electronic device package and method for manufacturing the same
Grant 11,335,650 - Hsu , et al. May 17, 2 | 2022-05-17 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20220115339 - SHIH; Yu-Lin ; et al. | 2022-04-14 |
Anti-loosing structure and backlight module
Grant 11,300,274 - Chou , et al. April 12, 2 | 2022-04-12 |
Package Substrate And Method For Manufacturing The Same
App 20220095462 - HSU; Wu Chou ; et al. | 2022-03-24 |
Semiconductor device package having a core substrate and an embedded component in the core substrate
Grant 11,276,660 - Lee March 15, 2 | 2022-03-15 |
Package substrate, electronic device package and method for manufacturing the same
Grant 11,239,184 - Hsu , et al. February 1, 2 | 2022-02-01 |
Semiconductor Device Package And Method For Manufacturing The Same
App 20220028801 - TIEN; Hsing Kuo ; et al. | 2022-01-27 |
Semiconductor device package and method of manufacturing the same
Grant 11,232,993 - Shih , et al. January 25, 2 | 2022-01-25 |
Electrical connection placement of semiconductor device package and method of manufacturing the same
Grant 11,233,022 - Ho , et al. January 25, 2 | 2022-01-25 |
Anti-loosing Structure And Backlight Module
App 20220010948 - CHOU; HUN-YI ; et al. | 2022-01-13 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210398904 - HO; Cheng-Lin ; et al. | 2021-12-23 |
Semiconductor device package and method of manufacturing the same
Grant 11,205,628 - Shih , et al. December 21, 2 | 2021-12-21 |
Package Substrate, Electronic Device Package And Method For Manufacturing The Same
App 20210391283 - HSU; Wu Chou ; et al. | 2021-12-16 |
Semiconductor Package Structure
App 20210391291 - Lee; Chih-Cheng ; et al. | 2021-12-16 |
Package Substrate, Electronic Device Package And Method For Manufacturing The Same
App 20210391284 - HSU; Wu Chou ; et al. | 2021-12-16 |
Semiconductor device package and method for manufacturing the same
Grant 11,201,386 - Ho , et al. December 14, 2 | 2021-12-14 |
Substrate, Semiconductor Device Package And Method Of Manufacturing The Same
App 20210366816 - HO; Cheng-Lin ; et al. | 2021-11-25 |
Embedded Component Package Structure And Manufacturing Method Thereof
App 20210343648 - TIEN; Hsing Kuo ; et al. | 2021-11-04 |
Semiconductor Device Package And Method For Manufacturing The Same
App 20210280565 - HUANG; Chien-Mei ; et al. | 2021-09-09 |
Substrate structure having pad portions
Grant 11,101,186 - Ho , et al. August 24, 2 | 2021-08-24 |
Substrate, semiconductor device package and method of manufacturing the same
Grant 11,088,061 - Ho , et al. August 10, 2 | 2021-08-10 |
Embedded component package structure and manufacturing method thereof
Grant 11,062,996 - Tien , et al. July 13, 2 | 2021-07-13 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210210446 - HO; Cheng-Lin ; et al. | 2021-07-08 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210202412 - SHIH; Yu-Lin ; et al. | 2021-07-01 |
Semiconductor device packages and method for manufacturing the same
Grant 11,031,274 - Shih , et al. June 8, 2 | 2021-06-08 |
Semiconductor substrate, semiconductor package, and method for forming the same
Grant 11,024,555 - Ho , et al. June 1, 2 | 2021-06-01 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210159200 - LEE; Chih Cheng | 2021-05-27 |
Semiconductor device package with stress buffering layer and method for manufacturing the same
Grant 11,018,120 - Huang , et al. May 25, 2 | 2021-05-25 |
Semiconductor device package and a method of manufacturing the same
Grant 11,004,779 - Peng , et al. May 11, 2 | 2021-05-11 |
Semiconductor Device Package And Method For Manufacturing The Same
App 20210135333 - HO; Cheng-Lin ; et al. | 2021-05-06 |
Semiconductor Device Package, Electronic Assembly And Method For Manufacturing The Same
App 20210125909 - HO; Cheng-Lin ; et al. | 2021-04-29 |
Semiconductor Device Packages And Method For Manufacturing The Same
App 20210090931 - SHIH; Yu-Lin ; et al. | 2021-03-25 |
Semiconductor Device Package And Method For Manufacturing The Same
App 20210035908 - LEE; Chih-Cheng ; et al. | 2021-02-04 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210035912 - TIEN; Hsing Kuo ; et al. | 2021-02-04 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20210013585 - Ho; Cheng-Lin ; et al. | 2021-01-14 |
Semiconductor device package, electronic assembly and method for manufacturing the same
Grant 10,886,208 - Ho , et al. January 5, 2 | 2021-01-05 |
Semiconductor Device Package And Method For Manufacturing The Same
App 20200388600 - HUANG; Chien-Mei ; et al. | 2020-12-10 |
Semiconductor Device Package And Method Of Manufacturing The Same
App 20200350223 - SHIH; Yu-Lin ; et al. | 2020-11-05 |
Semiconductor Substrate, Semiconductor Package, And Method For Forming The Same
App 20200279788 - HO; Cheng-Lin ; et al. | 2020-09-03 |
Semiconductor substrate including embedded component and method of manufacturing the same
Grant 10,748,843 - Tsai , et al. A | 2020-08-18 |
Semiconductor Package And Semiconductor Manufacturing Process
App 20200258826 - A1 | 2020-08-13 |
Antenna package and method of manufacturing the same
Grant 10,734,704 - Ho , et al. | 2020-08-04 |
Substrate, Semiconductor Device Package And Method Of Manufacturing The Same
App 20200211948 - HO; Cheng-Lin ; et al. | 2020-07-02 |
Semiconductor substrate, semiconductor package, and method for forming the same
Grant 10,665,523 - Ho , et al. | 2020-05-26 |
Antenna Package And Method Of Manufacturing The Same
App 20200161743 - HO; Cheng-Lin ; et al. | 2020-05-21 |
Semiconductor package and semiconductor manufacturing process
Grant 10,636,730 - Ho , et al. | 2020-04-28 |
Substrate structure and method for manufacturing the same
Grant 10,631,406 - Lee | 2020-04-21 |
Semiconductor Device Package, Electronic Assembly And Method For Manufacturing The Same
App 20200118912 - HO; Cheng-Lin ; et al. | 2020-04-16 |
Substrate, semiconductor device package and method of manufacturing the same
Grant 10,615,109 - Ho , et al. | 2020-04-07 |
Semiconductor Substrate, Semiconductor Package, And Method For Forming The Same
App 20200027810 - HO; Cheng-Lin ; et al. | 2020-01-23 |
Substrate having a conductive structure within photo-sensitive resin
Grant 10,515,884 - Chen , et al. Dec | 2019-12-24 |
Double plated conductive pillar package substrate
Grant 10,497,659 - Tsai , et al. De | 2019-12-03 |
Substrate, Semiconductor Device Package And Method Of Manufacturing The Same
App 20190348354 - HO; Cheng-Lin ; et al. | 2019-11-14 |
Semiconductor substrate and semiconductor packaging device, and method for forming the same
Grant 10,446,515 - Tsai , et al. Oc | 2019-10-15 |
Semiconductor device package and a method of manufacturing the same
Grant 10,424,547 - Lee , et al. Sept | 2019-09-24 |
Substrate Structure, Semiconductor Package Structure And Semiconductor Process
App 20190287867 - HO; Cheng-Lin ; et al. | 2019-09-19 |
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20190252305 - PENG; Po-Shu ; et al. | 2019-08-15 |
Semiconductor device package and a method of manufacturing the same
Grant 10,381,296 - Tsai , et al. A | 2019-08-13 |
Substrate structure, semiconductor package including the same, and method for manufacturing the same
Grant 10,354,969 - Shih , et al. July 16, 2 | 2019-07-16 |
Semiconductor package structure having a heat dissipation structure
Grant 10,340,212 - Lee , et al. | 2019-07-02 |
Semiconductor device package having a multi-portion connection element
Grant 10,332,757 - Shih , et al. | 2019-06-25 |
Reduced-dimension via-land structure and method of making the same
Grant 10,334,728 - Ho , et al. | 2019-06-25 |
Substrate for packaging a semiconductor device package and a method of manufacturing the same
Grant 10,325,842 - Lee , et al. | 2019-06-18 |
Semiconductor Package Structure Having A Heat Dissipation Structure
App 20190164871 - LEE; Chih Cheng ; et al. | 2019-05-30 |
Semiconductor Device Package Having A Multi-portion Connection Element
App 20190164782 - SHIH; Yu-Lin ; et al. | 2019-05-30 |
Semiconductor Substrate And Method For Manufacturing The Same
App 20190148280 - Lee; Chun-Che ; et al. | 2019-05-16 |
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20190148297 - HO; Cheng-Lin ; et al. | 2019-05-16 |
Embedded component package structure and method of manufacturing the same
Grant 10,276,507 - Lee , et al. | 2019-04-30 |
Substrate For Packaging A Semiconductor Device Package And A Method Of Manufacturing The Same
App 20190080995 - LEE; Chih-Cheng ; et al. | 2019-03-14 |
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20190067211 - LEE; Chih Cheng ; et al. | 2019-02-28 |
Substrate Sturcture, Semiconductor Package Including The Same, And Method For Manufacturing The Same
App 20190035753 - SHIH; Yu-Lin ; et al. | 2019-01-31 |
Semiconductor substrate mitigating bridging
Grant 10,181,438 - Lee , et al. Ja | 2019-01-15 |
Rotational input device
Grant 10,139,913 - Lee , et al. Nov | 2018-11-27 |
Double side via last method for double embedded patterned substrate
Grant 10,128,198 - Yen , et al. November 13, 2 | 2018-11-13 |
Substrate, semiconductor package structure and manufacturing process
Grant 10,096,542 - Lee , et al. October 9, 2 | 2018-10-09 |
Semiconductor package structure and semiconductor process
Grant 10,083,902 - Su , et al. September 25, 2 | 2018-09-25 |
Semiconductor package including dielectric layers defining via holes extending to component pads
Grant 10,079,156 - Lee , et al. September 18, 2 | 2018-09-18 |
Substrate, semiconductor package structure and manufacturing process
Grant 10,074,602 - Lee September 11, 2 | 2018-09-11 |
Semiconductor Substrate And Semiconductor Packaging Device, And Method For Forming The Same
App 20180254240 - TSAI; Li Chuan ; et al. | 2018-09-06 |
Semiconductor Device Package And A Method Of Manufacturing The Same
App 20180254238 - TSAI; Li Chuan ; et al. | 2018-09-06 |
Substrate, Semiconductor Package Structure And Manufacturing Process
App 20180240743 - LEE; Chih Cheng ; et al. | 2018-08-23 |
Thermoplastic resin composition and product formed therefrom
Grant 10,017,635 - Lee July 10, 2 | 2018-07-10 |
Semiconductor Device And Method Of Manufacturing The Same
App 20180166370 - LIN; Chai-Chi ; et al. | 2018-06-14 |
Semiconductor device and method of manufacturing the same
Grant 9,997,442 - Lin , et al. June 12, 2 | 2018-06-12 |
Substrate, semiconductor package including the same, and method for manufacturing the same
Grant 9,984,898 - Tsai , et al. May 29, 2 | 2018-05-29 |
Semiconductor Substrate Including Embedded Component And Method Of Manufacturing The Same
App 20180145017 - TSAI; Li Chuan ; et al. | 2018-05-24 |
Substrate, Semiconductor Package Structure And Manufacturing Process
App 20180138114 - Lee; Chih Cheng | 2018-05-17 |
Semiconductor Package And Semiconductor Manufacturing Process
App 20180130759 - HO; Cheng-Lin ; et al. | 2018-05-10 |
Semiconductor substrate, semiconductor module and method for manufacturing the same
Grant 9,966,333 - Tsai , et al. May 8, 2 | 2018-05-08 |
Semiconductor packages
Grant 9,917,071 - Chiu , et al. March 13, 2 | 2018-03-13 |
Embedded component package structure and method of manufacturing the same
Grant 9,887,167 - Lee , et al. February 6, 2 | 2018-02-06 |
Semiconductor Substrate, Semiconductor Module And Method For Manufacturing The Same
App 20180033719 - TSAI; Li-Chuan ; et al. | 2018-02-01 |
Substrate, Semiconductor Package Including The Same, And Method For Manufacturing The Same
App 20180005846 - TSAI; Li Chuan ; et al. | 2018-01-04 |
Double Plated Conductive Pillar Package Substrate
App 20170330851 - Tsai; Li-Chuan ; et al. | 2017-11-16 |
Semiconductor substrate, semiconductor module and method for manufacturing the same
Grant 9,812,387 - Tsai , et al. November 7, 2 | 2017-11-07 |
Embedded Component Package Structure And Method Of Manufacturing The Same
App 20170301626 - LEE; Chih-Cheng ; et al. | 2017-10-19 |
Double plated conductive pillar package substrate
Grant 9,754,906 - Tsai , et al. September 5, 2 | 2017-09-05 |
Double Side Via Last Method For Double Embedded Patterned Substrate
App 20170229402 - YEN; You-Lung ; et al. | 2017-08-10 |
Reduced-dimension Via-land Structure And Method Of Making The Same
App 20170231093 - HO; Cheng-Lin ; et al. | 2017-08-10 |
Semiconductor package with reduced via hole width and reduced pad patch and manufacturing method thereof
Grant 9,721,799 - Shih , et al. August 1, 2 | 2017-08-01 |
Thermoplastic Resin Composition And Product Formed Therefrom
App 20170190894 - Lee; Chih-Cheng | 2017-07-06 |
Double side via last method for double embedded patterned substrate
Grant 9,659,853 - Yen , et al. May 23, 2 | 2017-05-23 |
Semiconductor Substrate, Semiconductor Module And Method For Manufacturing The Same
App 20170077023 - TSAI; Li-Chuan ; et al. | 2017-03-16 |
Semiconductor substrate, semiconductor package structure and method of making the same
Grant 9,583,427 - Lee , et al. February 28, 2 | 2017-02-28 |
Semiconductor Substrate, Semiconductor Module And Method For Manufacturing The Same
App 20170019993 - TSAI; Li-Chuan ; et al. | 2017-01-19 |
Semiconductor substrate, semiconductor module and method for manufacturing the same
Grant 9,549,468 - Tsai , et al. January 17, 2 | 2017-01-17 |
Double Plated Conductive Pillar Package Subsatrate
App 20160379950 - Tsai; Li-Chuan ; et al. | 2016-12-29 |
Semiconductor Package Structure And Semiconductor Process
App 20160322292 - SU; Yuan-Chang ; et al. | 2016-11-03 |
Modified high-cis isoprene polymer, method for producing the same, and tire containing aforementioned polymer
Grant 9,481,746 - Lee , et al. November 1, 2 | 2016-11-01 |
Double Side Via Last Method For Double Embedded Patterned Substrate
App 20160315041 - YEN; You-Lung ; et al. | 2016-10-27 |
Rubber composition and manufacturing method for the same
Grant 9,475,917 - Cheng , et al. October 25, 2 | 2016-10-25 |
Substrate Structure And Method For Manufacturing The Same
App 20160286645 - LEE; Chih-Cheng | 2016-09-29 |
Circuit board with embedded passive component and manufacturing method thereof
Grant 9,426,891 - Tsai , et al. August 23, 2 | 2016-08-23 |
Semiconductor Substrate Structure, Semiconductor Package And Method Of Manufacturing The Same
App 20160240462 - CHEN; Tien-Szu ; et al. | 2016-08-18 |
Semiconductor Substrate, Semiconductor Package Structure And Method Of Making The Same
App 20160240469 - LEE; Chih-Cheng ; et al. | 2016-08-18 |
Semiconductor package structure and semiconductor process
Grant 9,420,695 - Su , et al. August 16, 2 | 2016-08-16 |
Semiconductor substrate, semiconductor package structure and method of making the same
Grant 9,373,601 - Lee , et al. June 21, 2 | 2016-06-21 |
Modified high cis butadiene-isoprene copolymer, method for producing the same and tire having aforementioned polymer
Grant 9,359,462 - Lee , et al. June 7, 2 | 2016-06-07 |
Circuit Board With Embedded Passive Component And Manufacturing Method Thereof
App 20160150651 - TSAI; Li-Chuan ; et al. | 2016-05-26 |
Semiconductor Package Structure And Semiconductor Process
App 20160143149 - SU; Yuan-Chang ; et al. | 2016-05-19 |
Semiconductor Package Including Embedded Components And Method Of Making The Same
App 20160133562 - LEE; Chih-Cheng ; et al. | 2016-05-12 |
Semiconductor Package With Embedded Component And Manufacturing Method Thereof
App 20160133537 - Shih; Yu-Lin ; et al. | 2016-05-12 |
Embedded Component Package Structure And Method Of Manufacturing The Same
App 20160064329 - LEE; Chih-Cheng ; et al. | 2016-03-03 |
Semiconductor Substrate, Semiconductor Package Structure And Method Of Making The Same
App 20150348931 - LEE; Chih-Cheng ; et al. | 2015-12-03 |
Modified High Cis Butadiene-isoprene Copolymer, Method For Producing The Same And Tire Having Aforementioned Polymer
App 20150166707 - Lee; Chih-Cheng ; et al. | 2015-06-18 |
Modified High-cis Isoprene Polymer, Method For Producing The Same, And Tire Containing Aforementioned Polymer
App 20150166698 - Lee; Chih-Cheng ; et al. | 2015-06-18 |
Modified copolymer of conjugated diene and vinyl aromatic hydrocarbon and polymerization method thereof
Grant 9,056,526 - Hsieh , et al. June 16, 2 | 2015-06-16 |
Polysiloxane compound, modified conjugated diene-vinyl aromatic copolymer and preparing method thereof
Grant 8,907,023 - Hsieh , et al. December 9, 2 | 2014-12-09 |
Quartz light
Grant 8,896,205 - Lee , et al. November 25, 2 | 2014-11-25 |
Modified conjugated diene polymer and synthesis method thereof
Grant 8,895,665 - Lee , et al. November 25, 2 | 2014-11-25 |
Modified Copolymer Of Conjugated Diene And Vinyl Aromatic Hydrocarbon And Polymerization Method Thereof
App 20140187720 - Hsieh; Kuan-Lin ; et al. | 2014-07-03 |
Polysiloxane Compound, Modified Conjugated Diene-vinyl Aromatic Copolymer And Preparing Method Thereof
App 20140187723 - Hsieh; Kuan-Lin ; et al. | 2014-07-03 |
Rubber Composition And Manufacturing Method For The Same
App 20140187696 - Cheng; Kuei-Lun ; et al. | 2014-07-03 |
Modified Conjugated Diene Polymer And Synthesis Method Thereof
App 20140179860 - Lee; Chih-Cheng ; et al. | 2014-06-26 |
Flexible Freight Bag And Method Of Transferring Cargo Using The Same
App 20140154045 - LEE; Chih-Cheng ; et al. | 2014-06-05 |
Modified high CIS conjugated diene copolymer and preparing method of the same
Grant 8,722,810 - Cheng , et al. May 13, 2 | 2014-05-13 |
Modified high cis conjugated diene copolymer and manufacturing method of the same
Grant 8,674,030 - Lee , et al. March 18, 2 | 2014-03-18 |
Modified High Cis Conjugated Diene Copolymer And Preparing Method Of The Same
App 20130172492 - Cheng; Kuei-Lun ; et al. | 2013-07-04 |
Modified High Cis Conjugated Diene Copolymer And Manufacturing Method Of The Same
App 20130158205 - Lee; Chih-Cheng ; et al. | 2013-06-20 |
Embedded substrate having circuit layer element with oblique side surface and method for making the same
Grant 8,461,461 - Lee June 11, 2 | 2013-06-11 |
Substrate Structure And Method For Manufacturing The Same
App 20130068517 - LEE; Chih-Cheng | 2013-03-21 |
Method of manufacturing a substrate structure
Grant 8,377,506 - Lee February 19, 2 | 2013-02-19 |
Substrate structure and method for manufacturing the same
Grant 8,322,032 - Lee December 4, 2 | 2012-12-04 |
Circuit substrate and manufacturing method thereof and package structure and manufacturing method thereof
Grant 8,258,009 - Lee , et al. September 4, 2 | 2012-09-04 |
Circuit Substrate And Manufacturing Method Thereof And Package Structure And Manufacturing Method Thereof
App 20120032331 - Lee; Chih-Cheng | 2012-02-09 |
Substrate Structure And Method For Manufacturing The Same
App 20110056739 - LEE; Chih-Cheng | 2011-03-10 |
Embedded Substrate Having Circuit Layer Element With Oblique Side Surface and Method for Making the Same
App 20100288542 - Lee; Chih-Cheng | 2010-11-18 |
Substrate Structure And Manufacturing Method Thereof
App 20100163287 - LEE; Chih-Cheng | 2010-07-01 |
Watch case
Grant D398,540 - Lee September 22, 1 | 1998-09-22 |
Watch case
Grant D397,619 - Lee September 1, 1 | 1998-09-01 |
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