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Sensor Package Structure
App 20220254752 - LEE; CHIEN-CHEN ; et al. | 2022-08-11 |
Sensor package structure
Grant 11,257,964 - Liu , et al. February 22, 2 | 2022-02-22 |
Image sensor package with particle blocking dam
Grant 11,227,885 - Hung , et al. January 18, 2 | 2022-01-18 |
Sensor Package Structure
App 20210305437 - LIU; FU-CHOU ; et al. | 2021-09-30 |
Chip-scale Sensor Package Structure
App 20210305304 - LIU; FU-CHOU ; et al. | 2021-09-30 |
Sensor package structure and sensing module thereof
Grant 11,133,348 - Hung , et al. September 28, 2 | 2021-09-28 |
Sensor Package Structure
App 20210288190 - LIU; FU-CHOU ; et al. | 2021-09-16 |
Chip-scale sensor package structure
Grant 10,964,615 - Hung , et al. March 30, 2 | 2021-03-30 |
Sensor Package Structure
App 20210057470 - HUNG; LI-CHUN ; et al. | 2021-02-25 |
Method for reducing warpage occurred to substrate strip after molding process
Grant 10,916,511 - Liu , et al. February 9, 2 | 2021-02-09 |
Sensor package structure
Grant 10,868,062 - Lee , et al. December 15, 2 | 2020-12-15 |
Sensor Package Structure And Sensing Module Thereof
App 20200350357 - HUNG; LI-CHUN ; et al. | 2020-11-05 |
Sensor package structure
Grant 10,825,851 - Yang , et al. November 3, 2 | 2020-11-03 |
Image Sensor Package
App 20200312898 - HUNG; LI-CHUN ; et al. | 2020-10-01 |
Chip-scale Sensor Package Structure
App 20200273766 - HUNG; LI-CHUN ; et al. | 2020-08-27 |
Optical sensor
Grant 10,700,111 - Hung , et al. | 2020-06-30 |
Sensor Package Structure
App 20200119070 - YANG; SHENG ; et al. | 2020-04-16 |
Sensor Package Structure
App 20200105809 - LEE; CHIEN-CHEN ; et al. | 2020-04-02 |
Optical Sensor
App 20200098809 - HUNG; LI-CHUN ; et al. | 2020-03-26 |
Multi-layer single chip MEMS WLCSP fabrication
Grant 10,106,399 - Lee , et al. October 23, 2 | 2018-10-23 |
Method and structure of MEMS PLCSP fabrication
Grant 9,975,759 - Lee , et al. May 22, 2 | 2018-05-22 |
Method And Structure Of Mems Plcsp Fabrication
App 20170313578 - LEE; Chien Chen ; et al. | 2017-11-02 |
Method and structure of MEMS PLCSP fabrication
Grant 9,738,510 - Lee August 22, 2 | 2017-08-22 |
Semiconductor Device and Method of Making Wafer Level Chip Scale Package
App 20170236802 - Hsieh; Ming-Che ; et al. | 2017-08-17 |
Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrate
Grant 9,685,402 - Chen , et al. June 20, 2 | 2017-06-20 |
Semiconductor device and method of making wafer level chip scale package
Grant 9,673,093 - Hsieh , et al. June 6, 2 | 2017-06-06 |
Method and structure of MEMS WLCSP fabrication
Grant 9,540,232 - Lee January 10, 2 | 2017-01-10 |
Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate
Grant 9,478,513 - Chen , et al. October 25, 2 | 2016-10-25 |
Semiconductor device and method of forming stress-reduced conductive joint structures
Grant 9,349,700 - Hsieh , et al. May 24, 2 | 2016-05-24 |
Semiconductor device and method of reflow soldering for conductive column structure in flip chip package
Grant 9,230,896 - Lee , et al. January 5, 2 | 2016-01-05 |
Method And Structure Of Mems Wlcsp Fabrication
App 20150166330 - Lee; Chien Chen | 2015-06-18 |
Semiconductor Device and Method of Making Wafer Level Chip Scale Package
App 20150041985 - Hsieh; Ming-Che ; et al. | 2015-02-12 |
Semiconductor Device and Method of Forming Stress-Reduced Conductive Joint Structures
App 20140319695 - Hsieh; Ming-Che ; et al. | 2014-10-30 |
Semiconductor Device with Conductive Pillars Having Recesses or Protrusions to Detect Interconnect Continuity Between Semiconductor Die and Substrate
App 20140225256 - Chen; Jen Yu ; et al. | 2014-08-14 |
Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate
Grant 8,741,764 - Chen , et al. June 3, 2 | 2014-06-03 |
Semiconductor Device and Method of Reflow Soldering for Conductive Column Structure in Flip Chip Package
App 20130320523 - Lee; Chien Chen ; et al. | 2013-12-05 |
Integrated Circuit Packaging System With Support Structure And Method Of Manufacture Thereof
App 20130249073 - Chen; Hsin Hung ; et al. | 2013-09-26 |
Semiconductor Device and Method of Forming Conductive Pillars Having Recesses or Protrusions to Detect Interconnect Continuity Between Semiconductor Die and Substrate
App 20130146872 - Chen; Jen Yu ; et al. | 2013-06-13 |
Semiconductor Device and Method of Forming Recesses in Conductive Layer to Detect Continuity for Interconnect Between Semiconductor Die and Substrate
App 20130147035 - Chen; Jen Yu ; et al. | 2013-06-13 |
System And Method For Executing Functions According To Captured Images
App 20100007755 - LEE; CHIEN-CHEN | 2010-01-14 |
Packaging methods
App 20070105270 - Lee; Chien Chen | 2007-05-10 |
Active device bases and leadframes utilizing the same
App 20070096290 - Lee; Chien-Chen | 2007-05-03 |
Active device bases, leadframes utilizing the same, and leadframe fabrication methods
App 20060071306 - Lee; Chien-Chen | 2006-04-06 |
Exposed pad module integrating a passive device therein
Grant 7,015,591 - Lee March 21, 2 | 2006-03-21 |
Multilayer leadframe module with embedded passive component and method of fabricating the same
App 20060006504 - Lee; Chien-Chen ; et al. | 2006-01-12 |
Exposed pad module integrated a passive device therein
App 20050224937 - Lee, Chien-Chen | 2005-10-13 |
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