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Lee; Chia-En Patent Filings

Lee; Chia-En

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Chia-En.The latest application filed is for "light-emitting diode packaging module".

Company Profile
17.39.52
  • Lee; Chia-En - Xiamen CN
  • Lee; Chia-En - Fujian CN
  • LEE; Chia-En - Funian CN
  • Lee; Chia-En - Chiayi TW
  • Lee; Chia-En - Chiayi City TW
  • LEE; Chia-En - Hsinchu TW
  • Lee; Chia-En - Chia Yi N/A TW
  • Lee; Chia-En - Shindian TW
  • Lee; Chia-En - Taipei Hsien TW
  • Lee; Chia-En - Taipei TW
  • Lee; Chia-En - Taipei City TW
  • Lee; Chia-En - Taoyuan County TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Light-emitting diode and method for transferring the same
Grant 11,456,400 - Wu , et al. September 27, 2
2022-09-27
Micro light emitting diode chip and method for manufacturing micro light emitting diode device including the same
Grant 11,424,387 - Lee , et al. August 23, 2
2022-08-23
Light emitting device and light emitting device assembly
Grant 11,380,829 - Ting , et al. July 5, 2
2022-07-05
Light-emitting Diode Packaging Module
App 20220199592 - XIN; SHUNING ;   et al.
2022-06-23
Light-emitting Diode Packaging Module
App 20220199590 - XIN; SHUNING ;   et al.
2022-06-23
Light-emitting Device And Display Screen Including The Same
App 20220157793 - LIAO; Yanqiu ;   et al.
2022-05-19
Light-emitting Diode Packaging Module
App 20220139890 - LIN; Zhen-duan ;   et al.
2022-05-05
Laser Diode And Method For Making The Same
App 20220059989 - ZHONG; Zhibai ;   et al.
2022-02-24
Micro Light-emitting Assembly, Micro Light-emitting Device Manufactured From The Same And Method For Mass Transfer Of Micro Light-emitting Devices
App 20220005794 - WU; Zheng ;   et al.
2022-01-06
Method And Device For Mass Transfer Of Micro Semiconductor Elements
App 20210407978 - ZHONG; Zhibai ;   et al.
2021-12-30
Method for mass transfer of micro semiconductor elements
Grant 11,127,723 - Zhong , et al. September 21, 2
2021-09-21
Process for packaging component
Grant 11,101,239 - Zhong , et al. August 24, 2
2021-08-24
Light emitting diode device and method for manufacturing the same
Grant 11,043,613 - Zhong , et al. June 22, 2
2021-06-22
Micro Light-emitting Device And Display
App 20210159370 - Hsu; Chen-ke ;   et al.
2021-05-27
Light-emitting Assembly
App 20210066262 - LIU; TUNG-KAI ;   et al.
2021-03-04
Micro Light-emitting Element And Device, And Use And Production Method Thereof
App 20210013388 - ZHONG; Zhibai ;   et al.
2021-01-14
Micro Light-emitting Element And Device And Transfer Method Thereof
App 20210005782 - TING; Shao-ying ;   et al.
2021-01-07
Light Emitting Device And Light Emitting Device Assembly
App 20200381603 - TING; SHAO-YING ;   et al.
2020-12-03
Micro Device Transferring Apparatus And Method For Transferring Micro Device
App 20200335383 - HSU; CHEN-KE ;   et al.
2020-10-22
Micro Light-emitting Component, Micro Light-emitting Component Matrix, And Method For Manufacturing The Micro Light-emitting Component Matrix
App 20200321392 - TING; Shao-Ying ;   et al.
2020-10-08
Light-emitting Diode And Method For Transferring The Same
App 20200303595 - WU; Zheng ;   et al.
2020-09-24
Method For Mass Transfer Of Micro Semicondutor Elements
App 20200273848 - ZHONG; ZHIBAI ;   et al.
2020-08-27
Process For Packaging Component
App 20200258861 - A1
2020-08-13
Structure And Method For Transferring A Micro Semiconductor Element
App 20200227302 - WU; ZHENG ;   et al.
2020-07-16
Micro Light Emitting Diode Chip And Method For Manufacturing Micro Light Emitting Diode Device Including The Same
App 20200220047 - Lee; Chia-En ;   et al.
2020-07-09
Light Emitting Diode Device And Method For Manufacturing The Same
App 20190319172 - ZHONG; ZHIBAI ;   et al.
2019-10-17
High-voltage light emitting diode chip and fabrication method
Grant 10,297,733 - Wu , et al.
2019-05-21
LED structure and fabrication method
Grant 10,283,677 - Liang , et al.
2019-05-07
Bonding electrode structure of flip-chip led chip and fabrication method
Grant 10,276,750 - Zhong , et al.
2019-04-30
Flip-chip light emitting device and fabrication method
Grant 10,186,637 - Zhong , et al. Ja
2019-01-22
Flip-chip high-voltage light emitting device and fabrication method
Grant 10,014,460 - Zhong , et al. July 3, 2
2018-07-03
Bonding Electrode Structure of Flip-chip LED Chip and Fabrication Method
App 20180145220 - ZHONG; Zhibai ;   et al.
2018-05-24
LED display and manufacturing method thereof
Grant 9,818,915 - Lee , et al. November 14, 2
2017-11-14
Flip-chip High-voltage Light Emitting Device and Fabrication Method
App 20170141280 - ZHONG; Zhibai ;   et al.
2017-05-18
LED Structure and Fabrication Method
App 20170141271 - LIANG; Xinghua ;   et al.
2017-05-18
Flip-chip Light Emitting Device and Fabrication Method
App 20170133557 - ZHONG; Zhibai ;   et al.
2017-05-11
High-voltage Light Emitting Diode Chip And Fabrication Method
App 20170110638 - WU; Hou-jun ;   et al.
2017-04-20
Led Display And Manufacturing Method Thereof
App 20170018691 - Lee; Chia-En ;   et al.
2017-01-19
LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount
App 20160380173 - Lee; Chia-En ;   et al.
2016-12-29
LED display and manufacturing method thereof
Grant 9,484,506 - Lee , et al. November 1, 2
2016-11-01
LED display and manufacturing method thereof
Grant 9,472,733 - Lee , et al. October 18, 2
2016-10-18
LED sub-mount and method for manufacturing light emitting device using the sub-mount
Grant 9,461,213 - Lee , et al. October 4, 2
2016-10-04
Led Display And Manufacturing Method Thereof
App 20160087165 - Lee; Chia-En ;   et al.
2016-03-24
Light-emitting diode with side-wall bump structure and mounting structure having the same
Grant 9,054,277 - Lee , et al. June 9, 2
2015-06-09
Led Display And Manufacturing Method Thereof
App 20140312368 - Lee; Chia-En ;   et al.
2014-10-23
Light-emitting Diode With Side-wall Bump Structure And Mounting Structure Having The Same
App 20140312379 - LEE; Chia-En ;   et al.
2014-10-23
Flip-chip light-emitting diode structure and manufacturing method thereof
Grant 8,859,311 - Lee , et al. October 14, 2
2014-10-14
LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount
App 20140231858 - Lee; Chia-En ;   et al.
2014-08-21
Light Emitting Diode And Fabrication Method Thereof
App 20140186981 - LEE; Chia-En
2014-07-03
Flip-chip Light-emitting Diode Structure And Manufacturing Method Thereof
App 20140061700 - Lee; Chia-En ;   et al.
2014-03-06
Electronic Unit Base And Electronic Module And Electronic Device Using The Same
App 20130215627 - LEE; Chia-En
2013-08-22
Light-emitting diode package and wafer-level packaging process of light-emitting diode
Grant 8,445,327 - Lee , et al. May 21, 2
2013-05-21
LED chip
Grant D680,975 - Lee , et al. April 30, 2
2013-04-30
LED chip
Grant D680,976 - Lee , et al. April 30, 2
2013-04-30
Light emitting diode chip
Grant 8,415,683 - Lee , et al. April 9, 2
2013-04-09
Semiconductor light emitting structure
Grant 8,362,511 - Fang , et al. January 29, 2
2013-01-29
Semiconductor Light Emitting Structure
App 20120286307 - Fang; Kuo-Lung ;   et al.
2012-11-15
LED chip
Grant D669,869 - Lee , et al. October 30, 2
2012-10-30
LED chip
Grant D668,234 - Lee , et al. October 2, 2
2012-10-02
Light-emitting diode package and wafer-level packaging process of light-emitting diode
Grant 8,278,681 - Lee , et al. October 2, 2
2012-10-02
Light Emitting Diode And Fabrication Method Thereof
App 20120193663 - LEE; Chia-En
2012-08-02
Device and method of testing a vibrating device
Grant 8,225,670 - Lee July 24, 2
2012-07-24
Light-Emitting Diode Package and Wafer-Level Packaging Process of Light-Emitting Diode
App 20120164768 - Lee; Chia-En ;   et al.
2012-06-28
Laser illumination device with adjustable light output
Grant 8,070,320 - Lee December 6, 2
2011-12-06
Production line
Grant 8,020,284 - Lee September 20, 2
2011-09-20
Assembly device
Grant 7,987,965 - Lee August 2, 2
2011-08-02
Motor vehicle and rickshaw and tilting mechanism thereof
Grant 7,946,596 - Hsu , et al. May 24, 2
2011-05-24
Fixture
Grant 7,867,020 - Lee January 11, 2
2011-01-11
Thickness gauge
Grant 7,861,429 - Lee January 4, 2
2011-01-04
Fixture
App 20100291781 - LEE; CHIA-EN
2010-11-18
Light Emitting Diode Chip And Manufacturing Method Thereof
App 20100258818 - Lee; Chia-En ;   et al.
2010-10-14
Light-emitting Diode Package And Wafer-level Packaging Process Of Light-emitting Diode
App 20100258827 - Lee; Chia-En ;   et al.
2010-10-14
Workpiece conveying mechanism and product line using the same
Grant 7,762,389 - Lee , et al. July 27, 2
2010-07-27
Device And Method Of Testing A Vibrating Device
App 20100175475 - LEE; CHIA-EN
2010-07-15
Production Line
App 20100162559 - LEE; CHIA-EN
2010-07-01
Production Line
App 20100147654 - LEE; CHIA-EN
2010-06-17
Laser Pen
App 20100060968 - LEE; CHIA-EN
2010-03-11
Assembly Device For Display Screen
App 20100044538 - LEE; CHIA-EN
2010-02-25
Conveyor Device
App 20100038208 - LEE; CHIA-EN ;   et al.
2010-02-18
Motor Vehicle And Rickshaw And Tilting Mechanism Thereof
App 20100032915 - Hsu; Mau-Pin ;   et al.
2010-02-11
Thickness Gauge
App 20090307919 - LEE; CHIA-EN
2009-12-17
Banner displaying device
Grant 7,596,897 - Lee October 6, 2
2009-10-06
Workpiece Conveying Mechanism And Product Line Using The Same
App 20090188775 - LEE; CHIA-EN ;   et al.
2009-07-30
Assembly Device
App 20090159398 - LEE; CHIA-EN
2009-06-25
Banner Displaying Device
App 20090158627 - LEE; CHIA-EN
2009-06-25
Test Device For A Foldable Object
App 20070180926 - Huang; Jie ;   et al.
2007-08-09

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