Lee; Chi Chung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Chi Chung.The latest application filed is for "pre-plated leadframe having enhanced encapsulation adhesion".
- Lee; Chi Chung - Hong Kong HK
- Lee; Chi Chung - Tai Po HK
| Patent | Date |
|---|---|
| Leadframe treatment for enhancing adhesion of encapsulant thereto Grant 8,012,886 - Kwan , et al. September 6, 2 | 2011-09-06 |
| Pre-plated leadframe having enhanced encapsulation adhesion Grant 7,691,679 - Kwan , et al. April 6, 2 | 2010-04-06 |
| Pre-plated Leadframe Having Enhanced Encapsulation Adhesion App 20080233683 - Kwan; Yiu Fai ; et al. | 2008-09-25 |
| Leadframe Treatment For Enhancing Adhesion Of Encapsulant Thereto App 20080216921 - KWAN; Yiu Fai ; et al. | 2008-09-11 |
| Electroplating apparatus Grant 6,274,010 - Henington , et al. August 14, 2 | 2001-08-14 |
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