| Patent | Date |
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Semiconductor Device Structure And Methods Of Forming The Same
App 20220310477 - LEE; Cheng-Chin ; et al. | 2022-09-29 |
Interconnect Structures Including Air Gaps
App 20220310442 - LEE; Cheng-Chin ; et al. | 2022-09-29 |
Interconnect Strucutre With Protective Etch-stop
App 20220293462 - Lee; Shao-Kuan ; et al. | 2022-09-15 |
Capping Layer Overlying Dielectric Structure To Increase Reliability
App 20220293512 - Lo; Ting-Ya ; et al. | 2022-09-15 |
Novel Self-aligned Via Structure By Selective Deposition
App 20220285266 - Lee; Shao-Kuan ; et al. | 2022-09-08 |
Semiconductor Interconnection Structure And Methods Of Forming The Same
App 20220285268 - LEE; Shao-Kuan ; et al. | 2022-09-08 |
Selective Deposition For Integrated Circuit Interconnect Structures
App 20220277996 - Huang; Hsin-Yen ; et al. | 2022-09-01 |
Dielectric Capping Structure Overlying A Conductive Structure To Increase Stability
App 20220254678 - Huang; Hsin-Yen ; et al. | 2022-08-11 |
Semiconductor Device Structure And Methods Of Forming The Same
App 20220223465 - HUANG; Hsin-Yen ; et al. | 2022-07-14 |
Method for manufacturing interconnect structures including air gaps
Grant 11,361,989 - Lee , et al. June 14, 2 | 2022-06-14 |
Capping layer overlying dielectric structure to increase reliability
Grant 11,355,430 - Lo , et al. June 7, 2 | 2022-06-07 |
Interconnect strucutre with protective etch-stop
Grant 11,355,390 - Lee , et al. June 7, 2 | 2022-06-07 |
Interconnect Structure
App 20220157711 - Lee; Shao-Kuan ; et al. | 2022-05-19 |
Thermal Interconnect Structure For Thermal Management Of Electrical Interconnect Structure
App 20220157690 - Lee; Shao-Kuan ; et al. | 2022-05-19 |
Selective deposition for integrated circuit interconnect structures
Grant 11,335,596 - Huang , et al. May 17, 2 | 2022-05-17 |
Interconnect Structure
App 20220139834 - LEE; Shao-Kuan ; et al. | 2022-05-05 |
Dielectric capping structure overlying a conductive structure to increase stability
Grant 11,322,395 - Huang , et al. May 3, 2 | 2022-05-03 |
Interconnect Structure
App 20220130756 - HUANG; Hsin-Yen ; et al. | 2022-04-28 |
Semiconductor Device And Method Of Manufacture
App 20220084941 - LEE; Shao-Kuan ; et al. | 2022-03-17 |
Interconnect structure and method for forming the same
Grant 11,227,833 - Lee , et al. January 18, 2 | 2022-01-18 |
Interconnect structure and method for forming the same
Grant 11,222,843 - Huang , et al. January 11, 2 | 2022-01-11 |
Metal Capping Layer and Methods Thereof
App 20210391209 - LEE; Shao-Kuan ; et al. | 2021-12-16 |
Semiconductor device comprising etch stop layer over dielectric layer and method of manufacture
Grant 11,189,560 - Lee , et al. November 30, 2 | 2021-11-30 |
Interconnect Strucutre With Protective Etch-stop
App 20210358803 - Lee; Shao-Kuan ; et al. | 2021-11-18 |
Using A Self-Assembly Layer To Facilitate Selective Formation of An Etching Stop Layer
App 20210351034 - Lee; Shao-Kuan ; et al. | 2021-11-11 |
Interconnect Layer And Methods Thereof
App 20210249299 - LEE; Cheng-Chin ; et al. | 2021-08-12 |
Metal capping layer and methods thereof
Grant 11,075,113 - Lee , et al. July 27, 2 | 2021-07-27 |
Using a self-assembly layer to facilitate selective formation of an etching stop layer
Grant 11,069,526 - Lee , et al. July 20, 2 | 2021-07-20 |
Dielectric Capping Structure Overlying A Conductive Structure To Increase Stability
App 20210193505 - Huang; Hsin-Yen ; et al. | 2021-06-24 |
Capping Layer Overlying Dielectric Structure To Increase Reliability
App 20210193566 - Lo; Ting-Ya ; et al. | 2021-06-24 |
Low-Resistance Interconnect
App 20210175119 - Huang; Hsin-Yen ; et al. | 2021-06-10 |
Interconnect Structure And Method For Forming The Same
App 20210082814 - Lee; Shao-Kuan ; et al. | 2021-03-18 |
Interconnect Structure And Method For Forming The Same
App 20210082802 - HUANG; Hsin-Yen ; et al. | 2021-03-18 |
Semiconductor Device And Method Of Manufacture
App 20210066187 - Lee; Shao-Kuan ; et al. | 2021-03-04 |
Methods for fabricating a low-resistance interconnect
Grant 10,930,551 - Huang , et al. February 23, 2 | 2021-02-23 |
Methods for Fabricating a Low-Resistance Interconnect
App 20200411374 - Huang; Hsin-Yen ; et al. | 2020-12-31 |
Selective deposition method for forming semiconductor structure
Grant 10,867,850 - Lee , et al. December 15, 2 | 2020-12-15 |
Selective Deposition for Integrated Circuit Interconnect Structures
App 20200135557 - Huang; Hsin-Yen ; et al. | 2020-04-30 |
Method For Forming Semiconductor Structure
App 20200020580 - LEE; Cheng-Chin ; et al. | 2020-01-16 |
Using A Self-assembly Layer To Facilitate Selective Formation Of An Etching Stop Layer
App 20200006060 - Lee; Shao-Kuan ; et al. | 2020-01-02 |
Metal Capping Layer And Methods Thereof
App 20200006116 - LEE; Shao-Kuan ; et al. | 2020-01-02 |
System and method for facilitating delivery and return service
Grant 7,068,149 - Lee , et al. June 27, 2 | 2006-06-27 |
System and method for facilitating delivery and return service
App 20050068178 - Lee, Cheng Chin ; et al. | 2005-03-31 |
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