LEE; Chee Hong
Patent Applications and Registrations
Patent applications and USPTO patent grants for LEE; Chee Hong.The latest application filed is for "method for connecting an electrical device to a bottom unit by using a solderless joint".
- LEE; Chee Hong - Melaka MY
- Lee; Chee Hong - Guangzhou Province CN
| Patent | Date |
|---|---|
| Method For Connecting An Electrical Device To A Bottom Unit By Using A Solderless Joint App 20220278085 - CHIANG; Chau Fatt ; et al. | 2022-09-01 |
| Semiconductor Package Having A Chip Carrier With A Pad Offset Feature App 20220102263 - Ng; Chee Yang ; et al. | 2022-03-31 |
| Semiconductor package having a laser-activatable mold compound Grant 11,289,436 - Lee , et al. March 29, 2 | 2022-03-29 |
| Pressure sensor having a lidless/laminate structure Grant 11,274,984 - Chiang , et al. March 15, 2 | 2022-03-15 |
| Semiconductor Package And Method For Fabricating The Same App 20210313294 - Chiang; Chau Fatt ; et al. | 2021-10-07 |
| Dual Step Laser Processing of an Encapsulant of a Semiconductor Chip Package App 20210050227 - Pok; Pei Luan ; et al. | 2021-02-18 |
| Pressure Sensor App 20210025774 - Chiang; Chau Fatt ; et al. | 2021-01-28 |
| Semiconductor Package Having a Laser-Activatable Mold Compound App 20200381380 - Lee; Chee Hong ; et al. | 2020-12-03 |
| Semiconductor package with air cavity Grant 10,777,536 - Chiang , et al. Sept | 2020-09-15 |
| Semiconductor Package with Air Cavity App 20190181120 - Chiang; Chau Fatt ; et al. | 2019-06-13 |
| USB connector Grant 7,758,359 - Chiu , et al. July 20, 2 | 2010-07-20 |
| USB connector App 20090215314 - Chiu; Ronald ; et al. | 2009-08-27 |
| USB connector Grant 7,553,172 - Chiu , et al. June 30, 2 | 2009-06-30 |
| USB Connector App 20080254680 - Chiu; Ronald ; et al. | 2008-10-16 |
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