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Patent applications and USPTO patent grants for LEE; Chang Suk.The latest application filed is for "cmp slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same".
Patent | Date |
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Cmp Slurry Composition For Polishing Tungsten Pattern Wafer And Method Of Polishing Tungsten Pattern Wafer Using The Same App 20220298382 - LEE; Ji Ho ;   et al. | 2022-09-22 |
Adhesive composition and method for preparing same Grant 11,292,944 - Hwang , et al. April 5, 2 | 2022-04-05 |
Adhesive composition and method for preparing same Grant 11,254,845 - Hwang , et al. February 22, 2 | 2022-02-22 |
Method for producing alkyl lactate Grant 11,186,535 - Kim , et al. November 30, 2 | 2021-11-30 |
Method For Producing N-acetyl Dipeptide And N-acetyl Amino Acid App 20210347817 - LEE; Joo Young ;   et al. | 2021-11-11 |
Adhesive Composition And Preparation Method Thereof App 20210269683 - HWANG; Ji Ho ;   et al. | 2021-09-02 |
Adhesive Composition, And Production Method Thereof App 20210269690 - HWANG; Ji Ho ;   et al. | 2021-09-02 |
Adhesive Composition, And Method For Preparing Same App 20210189180 - HWANG; Ji Ho ;   et al. | 2021-06-24 |
Adhesive Composition And Preparation Method Therefor App 20210189196 - HWANG; Ji Ho ;   et al. | 2021-06-24 |
Method For Producing Alkyl Lactate App 20210139406 - KIM; Jieun ;   et al. | 2021-05-13 |
Binder composition, article, and method for manufacturing article Grant 10,961,390 - Kim , et al. March 30, 2 | 2021-03-30 |
Binder Composition, Article, And Method For Manufacturing Article App 20200157344 - KIM; Ji Eun ;   et al. | 2020-05-21 |
Smartphone holder for vehicle Grant D881,111 - Lee | 2020-04-14 |
Adhesive Composition And Method For Preparing Same App 20200017730 - HWANG; Ji Ho ;   et al. | 2020-01-16 |
Adhesive Composition And Method For Preparing Same App 20200017729 - HWANG; Ji Ho ;   et al. | 2020-01-16 |
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