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Patent applications and USPTO patent grants for Lee; Chang-Ou.The latest application filed is for "titanium boride and titanium silicide contact barrier formation for integrated circuits".
Patent | Date |
---|---|
Titanium boride and titanium silicide contact barrier formation for integrated circuits Grant 5,745,990 - Lee , et al. May 5, 1 | 1998-05-05 |
Densification in an intermetal dielectric film Grant 5,610,105 - Vines , et al. March 11, 1 | 1997-03-11 |
Integrated circuit contact barrier formation with ion implant Grant 5,493,132 - Brugge , et al. February 20, 1 | 1996-02-20 |
Method of using corrosion prohibiters in aluminum alloy films Grant 5,434,104 - Cain , et al. July 18, 1 | 1995-07-18 |
New dry etch technique Grant 5,336,366 - Cain , et al. August 9, 1 | 1994-08-09 |
Rapid thermal oxidation of silicon in an ozone ambient Grant 5,294,571 - Fujishiro , et al. March 15, 1 | 1994-03-15 |
Integrated-circuit processing with progressive intermetal-dielectric deposition Grant 5,286,518 - Cain , et al. February 15, 1 | 1994-02-15 |
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