Lee; Chang-Chun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Chang-Chun.The latest application filed is for "method and apparatus for directional designature".
- Lee; Chang-Chun - Houston TX
- LEE; Chang-Chun - Chung Li City TW
- Lee; Chang-Chun - Chung Li TW
- Lee; Chang-Chun - Taipei TW
- Lee; Chang-Chun - Longtan Township TW
| Patent | Date |
|---|---|
| Method and apparatus for directional designature Grant 10,338,251 - Lee , et al. | 2019-07-02 |
| Method And Apparatus For Directional Designature App 20170184747 - LEE; Chang-Chun ; et al. | 2017-06-29 |
| Gate Configuration With Stress Impact Amplification App 20150372138 - LEE; Chang-Chun ; et al. | 2015-12-24 |
| Method of forming a metal bump Grant 9,129,957 - Ho , et al. September 8, 2 | 2015-09-08 |
| Handset Jacket Structure App 20110034220 - Lee; Chang-Chun | 2011-02-10 |
| Bump Structures And Packaged Structures Thereof App 20080042269 - Niu; Pao-Kang ; et al. | 2008-02-21 |
| Three-dimensional multichip stack electronic package structure Grant 7,211,886 - Hsu , et al. May 1, 2 | 2007-05-01 |
| Three-dimensional multichip stack electronic package structure App 20060273439 - Hsu; Yung-Yu ; et al. | 2006-12-07 |
| Three-dimensional multichip stack electronic package structure App 20050224947 - Hsu, Yung-Yu ; et al. | 2005-10-13 |
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