Lee; Chang-Cheol

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Chang-Cheol.The latest application filed is for "semiconductor package including semiconductor chip with through opening".

Company Profile

0.8.9

Lee; Chang-Cheol - Hwaseong-si KR
Lee; Chang-Cheol - Chungcheongnam-do KR
LEE; Chang-Cheol - Cheonan-City KR
Lee; Chang-Cheol - Cheonan KR
Lee; Chang Cheol - Asan KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package including semiconductor chip with through opening Grant 8,941,245 - Lee , et al. January 27, 2	2015-01-27
Semiconductor Package Including Semiconductor Chip With Through Opening App 20130105988 - LEE; Chang-Cheol ; et al.	2013-05-02
Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby Grant 7,374,966 - Kim , et al. May 20, 2	2008-05-20
Semiconductor Multi-chip Package And Fabrication Method App 20080026506 - KIM; Dong-Kuk ; et al.	2008-01-31
Semiconductor multi-chip package and fabrication method Grant 7,298,032 - Kim , et al. November 20, 2	2007-11-20
Apparatus For Stacking Semiconductor Chips, Method For Manufacturing Semiconductor Package Using The Same And Semiconductor Package Manufactured Thereby App 20070018295 - KIM; Min-Ill ; et al.	2007-01-25
Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package Grant 7,148,080 - Kim , et al. December 12, 2	2006-12-12
Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby Grant 7,135,353 - Kim , et al. November 14, 2	2006-11-14
Apparatus for bonding a chip using an insulating adhesive tape Grant 7,096,914 - Kim , et al. August 29, 2	2006-08-29
Device and method for manufacturing wafer-level package App 20060105477 - Lim; Suk-Kun ; et al.	2006-05-18
Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby App 20050054140 - Kim, Min-Ill ; et al.	2005-03-10
Semiconductor multi-chip package and fabrication method App 20040201088 - Kim, Dong-Kuk ; et al.	2004-10-14
Apparatus for bonding a chip using an insulating adhesive tape App 20040031570 - Kim, Dong-Kuk ; et al.	2004-02-19
Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package App 20040014257 - Kim, Pyoung Wan ; et al.	2004-01-22
Multi-chip package Grant 6,087,722 - Lee , et al. July 11, 2	2000-07-11

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