Lee; Chang Bo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Chang Bo.The latest application filed is for "fan-out semiconductor package".

Company Profile

3.5.24

Lee; Chang Bo - Suwon-Si KR
Lee; Chang Bo - Busan N/A KR
LEE; Chang Bo - Suwon KR
Lee; Chang Bo - Gyunggi-do KR
LEE; Chang Bo - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fan-out semiconductor package Grant 10,559,540 - Lee , et al. Feb	2020-02-11
Fan-out Semiconductor Package App 20190164908 - LEE; Chang Bo ; et al.	2019-05-30
Fan-out Semiconductor Package And Package Substrate Comprising The Same App 20190027419 - LEE; Chang Bo ; et al.	2019-01-24
Circuit Board And Manufacturing Method Of The Same App 20170019989 - LEE; Chang-Bo	2017-01-19
Circuit Substrate And Electronic Equipment Including The Same App 20160360609 - LEE; Chang-Bo	2016-12-08
Embedded Printed Circuit Board And Method Of Manufacturing The Same App 20160174381 - LEE; Chang-Bo ; et al.	2016-06-16
Composition for photoresist development and method of developing photoresist using the same Grant 9,235,129 - Lee , et al. January 12, 2	2016-01-12
Method For Forming Bumps And Substrate Including The Bumps App 20150373856 - CHOI; Cheol Ho ; et al.	2015-12-24
Embedded Board And Method Of Manufacturing The Same App 20150250050 - LEE; Chang Bo ; et al.	2015-09-03
Method for manufacturing printed circuit board Grant 9,107,329 - Lee , et al. August 11, 2	2015-08-11
Method For Manufacturing Substrate For Package App 20150198888 - LEE; Chang Bo ; et al.	2015-07-16
Solder Resist Opening Structure And Circuit Board App 20150156860 - LEE; Chang Bo ; et al.	2015-06-04
Method for forming solder resist and substrate for package Grant 9,040,838 - Lee , et al. May 26, 2	2015-05-26
Printed Circuit Board And Manufacturing Method Thereof App 20150053456 - LEE; CHANG BO ; et al.	2015-02-26
Composition For Photoresist Development And Method Of Developing Photoresist Using The Same App 20140370446 - Lee; Chang Bo ; et al.	2014-12-18
Package Substrate, Method For Manufacturing The Same, And Package On Package Substrate App 20140183726 - LEE; Chang Bo ; et al.	2014-07-03
Method For Forming Solder Resist And Substrate For Package App 20140054073 - LEE; Chang Bo ; et al.	2014-02-27
Flat Dam And Method For Manufacturing Chip Package Using The Same App 20140041911 - Lee; Chang Bo ; et al.	2014-02-13
Method For Manufacturing Printed Circuit Board App 20140037862 - Lee; Chang Bo ; et al.	2014-02-06
Etching Solution And Method Of Manufacturing Printed Wiring Substrate Using The Same App 20130175238 - HONG; Dae Jo ; et al.	2013-07-11
Solder Resist Composition, Board For Package Comprising Solder Resist Opening Using The Composition, And Method For Preparing The Board For Package App 20130089703 - HONG; Dae Jo ; et al.	2013-04-11
Method For Forming Bumps And Substrate Including The Bumps App 20130026626 - CHOI; Cheol Ho ; et al.	2013-01-31
Method For Manufacturing Printed Circuit Board App 20120285924 - LEE; Chang Bo ; et al.	2012-11-15
Method For Manufacturing Printed Circuit Board App 20120266463 - LEE; Chang Bo ; et al.	2012-10-25
Printed circuit board and manufacturing method thereof App 20120103662 - Lee; Chang Bo ; et al.	2012-05-03
Substrate Fabricating Apparatus And Substrate Fabricating Method App 20120055901 - Lee; Chang Bo ; et al.	2012-03-08

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