LEE; ByoungOk

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; ByoungOk.The latest application filed is for "direct-cooling for semiconductor device modules".

Company Profile

3.4.7

LEE; ByoungOk - Yeonsu-gu KR
LEE; Byoungok - Bucheon-si KR
Lee; ByoungOk - Incheon KR
Lee; Byoungok - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Direct-cooling For Semiconductor Device Modules App 20220157688 - EOM; JooYang ; et al.	2022-05-19
Integrated Circuit Direct Cooling Systems And Related Methods App 20220093487 - IM; Seungwon ; et al.	2022-03-24
Semiconductor package having a spacer with a junction cooling pipe Grant 11,201,105 - Im , et al. December 14, 2	2021-12-14
Stray inductance reduction in packaged semiconductor devices Grant 11,031,379 - Im , et al. June 8, 2	2021-06-08
Stray Inductance Reduction In Packaged Semiconductor Devices App 20210066256 - IM; Seungwon ; et al.	2021-03-04
Integrated Circuit Direct Cooling Systems And Related Methods App 20200185305 - IM; Seungwon ; et al.	2020-06-11
Semiconductor package having junction cooling pipes embedded in substrates Grant 10,607,919 - Im , et al.	2020-03-31
Integrated Circuit Direct Cooling Systems And Related Methods App 20180315681 - IM; Seungwon ; et al.	2018-11-01
Stray inductance reduction in packaged semiconductor devices and modules Grant 10,090,279 - Im , et al. October 2, 2	2018-10-02
Stray Inductance Reduction In Packaged Semiconductor Devices And Modules App 20180254262 - IM; Seungwon ; et al.	2018-09-06
Method For Speedy Delivery Of Data Between Processors And Digital Processing Apparatus Having Shared Memory App 20080005417 - Lee; Byoungok ; et al.	2008-01-03

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