LEE; Byoung Ok

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Byoung Ok.The latest application filed is for "method of ray tracing, apparatus performing the same and storage media storing the same".

Company Profile

0.14.15

LEE; Byoung Ok - Seongnam-si Gyeonggi-do KR
Lee; Byoung-Ok - Puchon KR
Lee; Byoung-Ok - Seongnam-si KR
Lee; Byoung-ok - Bucheon-si KR
Lee; Byoung-Ok - Kyonggido N/A KR
LEE; Byoung-ok - Bucheon KR
Lee; Byoung-ok - Gyeonggi-do N/A KR
Lee; Byoung-ok - Kyungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Ray Tracing, Apparatus Performing The Same And Storage Media Storing The Same App 20160239994 - CHUNG; Woo Nam ; et al.	2016-08-18
Semiconductor die package and method for making the same Grant 9,159,656 - Jeon , et al. October 13, 2	2015-10-13
Card-type information recording medium having embedded antenna for near field communication and manufacturing method thereof Grant 9,141,905 - Baek , et al. September 22, 2	2015-09-22
Card-type information recording medium having embedded antenna for near field communication and manufacturing method thereof Grant 9,070,071 - Baek , et al. June 30, 2	2015-06-30
Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package Grant 8,945,992 - Son , et al. February 3, 2	2015-02-03
Card-type Information Recording Medium Having Embedded Antenna For Near Field Communication And Manufacturing Method Thereof App 20140299667 - Baek; Dong-Hyun ; et al.	2014-10-09
Semiconductor Die Package And Method For Making The Same App 20140167238 - Jeon; Oseob ; et al.	2014-06-19
Semiconductor die package and method for making the same Grant 8,664,752 - Jeon , et al. March 4, 2	2014-03-04
Semiconductor Package And Method Of Fabricating The Same App 20130307145 - CHUNG; Yoon-jae ; et al.	2013-11-21
Power device packages having thermal electric modules using peltier effect and methods of fabricating the same Grant 8,552,541 - Lim , et al. October 8, 2	2013-10-08
Card-type Information Recording Medium Having Embedded Antenna For Near Field Communication And Manufacturing Method Thereof App 20120255763 - Baek; Dong-Hyun ; et al.	2012-10-11
Semiconductor Die Package And Method For Making The Same App 20120181675 - Jeon; Oseob ; et al.	2012-07-19
Semiconductor die package and method for making the same Grant 8,183,088 - Jeon , et al. May 22, 2	2012-05-22
Power Device Package Comprising Metal Tab Die Attach Paddle (dap) And Method Of Fabricating The Package App 20120034741 - Son; Joon-seo ; et al.	2012-02-09
Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package Grant 8,067,826 - Son , et al. November 29, 2	2011-11-29
Power Device Packages Having Thermal Electric Modules Using Peltier Effect And Methods Of Fabricating The Same App 20110204500 - Lim; Seung-won ; et al.	2011-08-25
Semiconductor Die Package And Method For Making The Same App 20100258925 - Jeon; Oseob ; et al.	2010-10-14
Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same App 20090243078 - Lim; Seung-won ; et al.	2009-10-01
Portable Terminal Having Inputting Means Using Image Sensor App 20090201256 - Jeong; Jong-Sik ; et al.	2009-08-13
Power Device Package Comprising Metal Tab Die Attach Paddle (dap) And Method Of Fabricating The Package App 20080164589 - Son; Joon-seo ; et al.	2008-07-10
Power module package having improved heat dissipating capability Grant 7,208,819 - Jeun , et al. April 24, 2	2007-04-24
Semiconductor die package and method for making the same App 20070001278 - Jeon; Oseob ; et al.	2007-01-04
Power module package having improved heat dissipating capability Grant 7,061,080 - Jeun , et al. June 13, 2	2006-06-13
Power module package having improved heat dissipating capability App 20050056918 - Jeun, Gi-young ; et al.	2005-03-17
Power module package having improved heat dissipating capability App 20030011054 - Jeun, Gi-young ; et al.	2003-01-16

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