Lee; Byoung Do

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lee; Byoung Do.The latest application filed is for "semiconductor chip and stacked type semiconductor package having the same".

Company Profile

0.7.5

Lee; Byoung Do - Incheon KR
Lee; Byoung Do - Gyeonggi-do N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor chip and stacked type semiconductor package having the same Grant 9,390,997 - Kim , et al. July 12, 2	2016-07-12
Semiconductor Chip And Stacked Type Semiconductor Package Having The Same App 20150008588 - KIM; Jong Hoon ; et al.	2015-01-08
Stack package and method for selecting chip in stack package Grant 8,810,309 - Lee , et al. August 19, 2	2014-08-19
Stack package having flexible conductors Grant 8,680,688 - Kang , et al. March 25, 2	2014-03-25
Stack Package Having Flexible Conductors App 20130001779 - KANG; Tae Min ; et al.	2013-01-03
Stack package having flexible conductors Grant 8,288,873 - Kang , et al. October 16, 2	2012-10-16
Stack Package And Method For Selecting Chip In Stack Package App 20120154020 - LEE; Dae Woong ; et al.	2012-06-21
Stack semiconductor package and method for manufacturing the same Grant 8,164,200 - Kang , et al. April 24, 2	2012-04-24
Stack Package Having Flexible Conductors App 20110254167 - KANG; Tae Min ; et al.	2011-10-20
Stack Semiconductor Package And Method For Manufacturing The Same App 20110121454 - KANG; Tae Min ; et al.	2011-05-26

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