Lee; Benjamin I.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lee; Benjamin I..The latest application filed is for "method and device for percutaneous sealing of internal puncture sites".
- Lee; Benjamin I. - Washington DC
| Patent | Date |
|---|---|
| Method and device for percutaneous sealing of internal puncture sites Grant 6,033,427 - Lee March 7, 2 | 2000-03-07 |
| Methods and device for percutaneous sealing of arterial puncture sites Grant 5,443,481 - Lee August 22, 1 | 1995-08-22 |
| Methods and device for percutanceous sealing of arterial puncture sites Grant 5,292,332 - Lee March 8, 1 | 1994-03-08 |
| Thermal balloon angioplasty with thermoplastic stent Grant 5,292,321 - Lee March 8, 1 | 1994-03-08 |
| Thermal balloon angioplasty Grant 5,190,540 - Lee March 2, 1 | 1993-03-02 |
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