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Patent applications and USPTO patent grants for Lee; Bae Gen.The latest application filed is for "embedded multilayer ceramic electronic component and printed circuit board having the same".
Patent | Date |
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Multilayer ceramic electronic part to be embedded in board and printed circuit board having multilayer ceramic electronic part embedded therein Grant 9,198,297 - Lee , et al. November 24, 2 | 2015-11-24 |
Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein Grant 9,173,294 - Lee , et al. October 27, 2 | 2015-10-27 |
Embedded Multilayer Ceramic Electronic Component And Printed Circuit Board Having The Same App 20150098202 - LEE; Byoung Hwa ;   et al. | 2015-04-09 |
Multilayer Ceramic Electronic Part To Be Embedded In Board And Printed Circuit Board Having Multilayer Ceramic Electronic Part Embedded Therein App 20150053471 - LEE; Hai Joon ;   et al. | 2015-02-26 |
Multilayer Ceramic Electronic Component To Be Embedded In Board And Printed Circuit Board Having Multilayer Ceramic Electronic Component Embedded Therein App 20150041199 - LEE; Byoung Hwa ;   et al. | 2015-02-12 |
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