Ledermann; Peter G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ledermann; Peter G..The latest application filed is for "packages for stacked integrated circuit chip cubes".

Company Profile

0.12.0

Ledermann; Peter G. - Peekskill NY
Ledermann; Peter G. - Ossining NY
Ledermann; Peter G. - Pleasantville NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packages for stacked integrated circuit chip cubes Grant 5,343,366 - Cipolla , et al. August 30, 1	1994-08-30
Integrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a tester Grant 5,189,363 - Bregman , et al. February 23, 1	1993-02-23
Dam for lead encapsulation Grant 5,130,781 - Kovac , et al. July 14, 1	1992-07-14
Tamper resistant packaging for information protection in electronic circuitry Grant 5,117,457 - Comerford , et al. May 26, 1	1992-05-26
Solder placement nozzle with inert cover gas and inert gas bleed Grant 5,065,932 - Hayden , et al. November 19, 1	1991-11-19
Solder placement nozzle assembly Grant 5,042,708 - Ledermann , et al. August 27, 1	1991-08-27
Multilevel integrated circuit packaging structures Grant 5,028,983 - Bickford , et al. July 2, 1	1991-07-02
Integrated circuit package with improved cooling means Grant 4,970,579 - Arldt , et al. November 13, 1	1990-11-13
Solder deposition system Grant 4,934,309 - Ledermann , et al. June 19, 1	1990-06-19
Solder deposition system Grant 4,898,117 - Ledermann , et al. February 6, 1	1990-02-06
Dam for lead encapsulation Grant 4,881,885 - Kovac , et al. November 21, 1	1989-11-21
Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape Grant 4,814,855 - Hodgson , et al. March 21, 1	1989-03-21

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